Solder distribution of semiconductor device heat radiation module

Abstract

The invention provides a solder distribution structure of a semiconductor device heat radiation module. The structure comprises a heat sink, a first solder layer, a second solder layer and a chip. The first solder layer is arranged on the heat sink. The second solder layer is arranged at the side surface of the heat sink and connected with the first solder layer. The chip is arranged on the first solder layer and has a top and bottom electrode structure. One second solder layer is also grown on one side surface of the heat sink, and the main effect of the second solder layer is to guide the hunched first solder layer to flow to one side of the heat sink in the sintering process so that climbing of the first solder layer to a tube core direction can be effectively prevented, a problem of short circuit of the tube core or light shielding due to the fact that the first solder layer climbs to the tube core direction can be effectively prevented, and thus yield rate, reliability and stability of the device can be enhanced.

Description

technical field [0001] The invention relates to solder distribution of a heat dissipation module of a semiconductor device, belongs to the field of semiconductor device manufacturing, and relates to a preparation process of a heat dissipation module of a semiconductor device. Background technique [0002] Semiconductor devices refer to discrete devices made of semiconductor materials. According to different semiconductor materials, different processes and geometric structures, researchers have developed a variety of semiconductor devices with different functions. These semiconductor devices are widely used in information storage, communication, military and medical fields. This requires semiconductor devices to have the characteristics of excellent performance, small size, light weight and low power consumption. In order to achieve the above goals, very high requirements are put forward for the manufacturing process of the semiconductor device heat dissipation module. [...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned problem that the solder bulges easily caused by the heat sink and the tube core during the sintering process, and climbs to the tube core to cause a short circuit or light blocking of the tube core, the present invention provides a solder distribution structure for a heat dissipation module of a semiconductor device. It can effectively guide the solder to flow toward the heat sink during sintering, prevent the solder from cooling into a ball after cooling down, and climb to the die to cause light blocking and chip short circuit, effectively solving the problem of short circuit or short circuit in the sintering process of existing semiconductor devices The problem of light blocking improves the yield, reliability and stability of the device

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