Solder distribution of semiconductor device heat radiation module

A technology for heat dissipation modules and semiconductors, which is applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as chip short circuit and short circuit.
CN104966705AActive Publication Date: 2015-10-07BEIJING UNIV OF TECH
5 Cites 5 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BEIJING UNIV OF TECH
Publication Date
2015-10-07

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides a solder distribution structure of a semiconductor device heat radiation module. The structure comprises a heat sink, a first solder layer, a second solder layer and a chip. The first solder layer is arranged on the heat sink. The second solder layer is arranged at the side surface of the heat sink and connected with the first solder layer. The chip is arranged on the first solder layer and has a top and bottom electrode structure. One second solder layer is also grown on one side surface of the heat sink, and the main effect of the second solder layer is to guide the hunched first solder layer to flow to one side of the heat sink in the sintering process so that climbing of the first solder layer to a tube core direction can be effectively prevented, a problem of short circuit of the tube core or light shielding due to the fact that the first solder layer climbs to the tube core direction can be effectively prevented, and thus yield rate, reliability and stability of the device can be enhanced.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to solder distribution of a heat dissipation module of a semiconductor device, belongs to the field of semiconductor device manufacturing, and relates to a preparation process of a heat dissipation module of a semiconductor device. Background technique

[0002] Semiconductor devices refer to discrete devices made of semiconductor materials. According to different semiconductor materials, different processes and geometric structures, researchers have developed a variety of semiconductor devices with different functions. These semiconductor devices are widely used in information storage, communication, military and medical fields. This requires semiconductor devices to have the characteristics of excellent performance, small size, light weight and low power consumption. In order to achieve the above goals, very high requirements are put forward for the manufacturing process of the semiconductor device heat dissipation module. [...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More