A miniaturized shielding box for microwave circuit packaging based on 3D printing manufacturing technology
A manufacturing technology, three-dimensional printing technology, applied in the direction of magnetic/electric field shielding, electrical components, etc., can solve problems such as cavity resonance noise, achieve the effects of suppressing cavity noise, high production costs, and ensuring normal operation and related performance
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[0016] The implementation of a new type of microwave circuit packaging shielding box based on the three-dimensional printing manufacturing technology provided by the present invention will be described in detail below in conjunction with the accompanying drawings:
[0017] A novel packaging shielding box for microwave circuit packaging designed by the present invention such as figure 1 As shown, it includes a package shielding box cover 1, an inverted umbrella-shaped metal periodic unit 2, and the inverted umbrella-shaped metal period unit 2 is connected to the package shielding box cover 1. The lower surface and the surrounding area of the inverted umbrella-shaped metal period unit 2 are relatively large, increasing Cell capacitance, lowers the center frequency of the stopband. figure 2 It is the package shielding box cavity 3 . A series inductance-capacitance resonance is formed between each inverted umbrella-shaped periodic unit 2 and the packaging shielding box cavity ...
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