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A miniaturized shielding box for microwave circuit packaging based on 3D printing manufacturing technology

A manufacturing technology, three-dimensional printing technology, applied in the direction of magnetic/electric field shielding, electrical components, etc., can solve problems such as cavity resonance noise, achieve the effects of suppressing cavity noise, high production costs, and ensuring normal operation and related performance

Inactive Publication Date: 2018-07-20
NANJING NORMAL UNIVERSITY
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a new type of microwave circuit packaging shielding box based on three-dimensional printing manufacturing technology, to overcome the technical defect of cavity resonance noise caused by microwave circuit loading metal shielding box; and to introduce three-dimensional printing technology to process the designed complex shielding box structure, which overcomes the shortcomings of traditional mechanical processing technology

Method used

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  • A miniaturized shielding box for microwave circuit packaging based on 3D printing manufacturing technology
  • A miniaturized shielding box for microwave circuit packaging based on 3D printing manufacturing technology
  • A miniaturized shielding box for microwave circuit packaging based on 3D printing manufacturing technology

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Embodiment Construction

[0016] The implementation of a new type of microwave circuit packaging shielding box based on the three-dimensional printing manufacturing technology provided by the present invention will be described in detail below in conjunction with the accompanying drawings:

[0017] A novel packaging shielding box for microwave circuit packaging designed by the present invention such as figure 1 As shown, it includes a package shielding box cover 1, an inverted umbrella-shaped metal periodic unit 2, and the inverted umbrella-shaped metal period unit 2 is connected to the package shielding box cover 1. The lower surface and the surrounding area of ​​the inverted umbrella-shaped metal period unit 2 are relatively large, increasing Cell capacitance, lowers the center frequency of the stopband. figure 2 It is the package shielding box cavity 3 . A series inductance-capacitance resonance is formed between each inverted umbrella-shaped periodic unit 2 and the packaging shielding box cavity ...

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Abstract

The invention discloses a novel three-dimensional printing manufacturing technology-based microwave circuit packaging shielding box. The shielding box not only has a relatively small size, but also has good cavity die suppression performance; and the shielding box includes a metal box cover and a metal box cavity, wherein the metal box cover is realized through three-dimensional printing manufacturing technology. Two-dimensional periodic structure units are arranged on an inner surface of the metal box cover, each structure unit consists of metal columns and a concave metal cover, thereby forming an inverted umbrella-shaped structure, one end of the metal column is vertically connected with an inner surface of a shielding box cover, and the other end of the metal column is vertically connected with an inner surface of the bottom of a groove of the concave metal cover. Series inductance and capacitance resonance is formed between each inverted umbrella-shaped structure unit and the shielding box bottom right under the unit, parallel inductance and capacitance resonance is formed between the inverted umbrella-shaped structure units, and the two kinds of resonance jointly form a stop band that suppresses noise in the packaging shielding box, and thus normal operation of a microwave circuit in the packaging shielding box can be effectively guaranteed.

Description

technical field [0001] The invention belongs to the field of electromagnetic field and microwave technology. It specifically relates to a novel microwave circuit packaging shielding box based on three-dimensional printing manufacturing technology. Background technique [0002] With the continuous improvement of microwave integrated circuit production technology, many complex microwave and millimeter wave circuit module components have been developed to adapt to the development of the times. Since most microwave and millimeter wave circuit module components are in the outdoor working environment, they are easily affected by the harsh natural environment, so in general, they need to be shielded with metal packaging; another advantage of this is that it can prevent packaging of internal circuit modules. Electromagnetic interference between the environment and the surrounding environment. However, since the metal shielding box itself is also a resonant cavity structure, the el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00
Inventor 庄伟唐万春周佳威施永荣于正永马建文星刘莹莹李宝珠
Owner NANJING NORMAL UNIVERSITY
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