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Semiconductor device with features to prevent reverse engineering

A device and characteristic technology, applied in the field of semiconductor devices with anti-reverse engineering characteristics, can solve problems such as expensive, error, and time-consuming

Active Publication Date: 2018-03-02
VERISITI LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These techniques are more time-consuming, more expensive, and more likely to be error-prone

Method used

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  • Semiconductor device with features to prevent reverse engineering
  • Semiconductor device with features to prevent reverse engineering
  • Semiconductor device with features to prevent reverse engineering

Examples

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Embodiment Construction

[0046] Many semiconductor processes that include logic functions provide different types of metal-oxide-semiconductor (MOS) devices used in different environments. For example, a device can only operate at lower voltages and its size can be scaled to the smallest geometry. Another device can operate at a higher voltage and its size cannot be scaled to the smallest geometry. The use of such devices allows semiconductor devices to interface with external signals that are at higher voltages than the internal minimum size devices.

[0047]The type of MOS device in the previous example is generally controlled by the electrical properties of the diffusion material. These properties are altered by slightly altering the atomic structure of the material with ion implantation dose and energy. This process is often described as "doping". Such slight changes in electrical characteristics cannot be detected by traditional reverse engineering disassembly techniques.

[0048] To provide ...

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Abstract

The ROM circuit includes: a first N-channel transistor having an output and device geometry and device characteristics suitable for biasing the output at a predetermined level when the P-channel circuit is connected to the first N-channel transistor; a pass transistor , connected between the output and the data bus, the pass transistor connected to a word line adapted to turn on the pass transistor when the word line is asserted; and a P-channel circuit connected to the data bus and adapted to A leakage current is provided to charge the gate of the first N-channel transistor when the pass transistor is turned on.

Description

[0001] This application claims priority to U.S. Patent Application Serial No. 13 / 739,463, filed November 2013, which is a continuation-in-part of U.S. Patent Application Serial No. 13 / 663,921, filed October 30, 2012, which was filed July 29, 2011 13 / 194,452, which claims the benefit of US Provisional Application Serial No. 61 / 494,172, filed July 2011, which is hereby incorporated by reference in its entirety. Background technique [0002] It is hoped to design electronic chips that are difficult to reverse engineer in order to protect circuit designs. Known reverse engineering techniques include methods that disassemble layers of a chip to expose logic devices. [0003] Semiconductor teardown techniques typically involve imaging a device layer, removing that layer, imaging the next layer, removing that layer, and so on until a complete representation of the semiconductor device is achieved. Imaging of the layers is usually accomplished with an optical or electron microscope. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/112
CPCG11C17/12G06F21/87H01L23/57H01L2924/0002G06F21/79H10B20/38H01L2924/00G11C16/0408G11C16/26
Inventor 威廉·埃利·撒克罗伯特·弗朗西斯·滕采尔迈克尔·克林顿·霍克
Owner VERISITI LLC
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