A pre-alignment system and method for flip-chip bonding

Abstract

The invention provides a pre-alignment system and a pre-alignment method for bonding flip chips. The pre-alignment system comprises a flip chip glue dipping structure, an upper vision optical structure and a flip chip placement head, wherein the flip chip glue dipping structure comprises a glue dipping plate, mechanical sliding rails connected with two sides of the glue dipping plate in a slided manner, and a motor driving the mechanical sliding rails to slide; and the upper vision optical structure comprises a deflecting prism which is fixed between the mechanical sliding rails and arranged under the glue dipping plate, and an industrial camera acquiring images of the flip chips. According to the pre-alignment system and the pre-alignment method, the flip chip placement head picks up one flip chip, moves to a position above the glue dipping plate for dipping glue according to a first trajectory and is lifted upwards after the glue dipping of the flip chip is finished, the mechanical sliding rails drives the glue dipping plate to slide according to a second trajectory and avert from the deflecting prism, then the flip chip after glue dipping is pre-aligned via the upper vision optical structure. Through the pre-alignment system provided by the invention, the bonding accuracy and efficiency are greatly increased, and the requirements of high-precision chip loading are satisfied.

Description

technical field [0001] The present invention relates to the technical field of flip-chip bonding, and in particular, to a pre-alignment system and method for flip-chip bonding. Background technique [0002] With the rapid development of global electronic information technology, integrated circuit chips continue to develop in the direction of high density, high performance, light, thin and short. In order to meet the packaging requirements of IC (Integrated Circuit, integrated circuit), the number of bumps on the chip will increase. more. With the increase in the number of bumps, the existing chip-loading equipment has been challenged. One of the main difficulties is how to load chips with high-density, small-pitch bumps with high precision. [0003] At present, in the chip loading equipment, the chip is generally picked up and then directly loaded with glue, but there is a major problem in this method: after picking up the chip, the chip is directly loaded without pre-align...

AI Technical Summary

Problems solved by technology

[0003] At present, in the chip loading equipment, the chips are generally picked up and dipped in glue to complete the chip loading directly. However, there is a major problem in this method: after picking up the chips, they are directly loaded without pre-alignment, so it is impossible to eliminate the slight deviation that may exist during picking. It is difficult to improve the accuracy of film loading

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