A pre-alignment system and method for flip-chip bonding
A flip-chip and pre-alignment technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems that small deviations cannot be eliminated, and the accuracy of chip loading is difficult to improve, so as to accurately correct deviations and improve Accuracy and efficiency, the effect of eliminating small deviations
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Embodiment 1
[0038] According to one aspect of the present invention, there is provided a pre-alignment system for flip-chip bonding, such as figure 1 As shown, the pre-alignment system includes:
[0039] A flip-chip dipping structure 1 installed on a workbench, the flip-chip dipping structure 1 includes: a dipping board 101 for flip-chip dipping; 102; a motor electrically connected to the mechanical slide rail 102 for driving the mechanical slide rail 102 to slide;
[0040] The top-view optical structure 2 installed on the worktable, the top-view optical structure 2 includes: a turning prism 201 fixed between the mechanical slide rails 102 and located under the glue board 101; an industrial camera for acquiring flip-chip images 202; wherein the turning prism 201 and the industrial camera 202 are connected through the lens 2021 of the industrial camera 202, and
[0041] like image 3 As shown in the above, the flip-chip mounting head 3 for picking up the flip-chip is located above the d...
Embodiment 2
[0050] In an embodiment of the present invention, a pre-alignment method for flip-chip bonding is provided, which is applied to the above-mentioned pre-alignment system for flip-chip bonding. The pre-alignment system includes: Flip-chip dipping structure 1, the flip-chip dipping structure 1 includes: a dipping plate 101 for flip-chip dipping; mechanical slide rails 102 slidingly connected to both sides of the dipping plate 101; 102 is electrically connected, and is used to drive the motor for sliding the mechanical slide rail 102; the upward-looking optical structure 2 installed on the workbench, the upward-looking optical structure 2 includes: fixed between the mechanical slide rails 102, and located below the rubber dipping plate 101 A turning prism 201; an industrial camera 202 for obtaining flip-chip images; wherein, the turning prism 201 and the industrial camera 202 are connected through the lens 2021 of the industrial camera 202, and are located above the glue board 101 ...
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Abstract
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Application Information
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