The invention provides a pre-alignment
system and a pre-alignment method for bonding flip chips. The pre-alignment
system comprises a
flip chip glue dipping structure, an upper vision optical structure and a
flip chip placement head, wherein the
flip chip glue dipping structure comprises a glue dipping plate, mechanical sliding rails connected with two sides of the glue dipping plate in a slided manner, and a motor driving the mechanical sliding rails to slide; and the upper vision optical structure comprises a deflecting
prism which is fixed between the mechanical sliding rails and arranged under the glue dipping plate, and an industrial camera acquiring images of the flip chips. According to the pre-alignment
system and the pre-alignment method, the flip
chip placement head picks up one flip
chip, moves to a position above the glue dipping plate for dipping glue according to a first trajectory and is lifted upwards after the glue dipping of the flip
chip is finished, the mechanical sliding rails drives the glue dipping plate to slide according to a second trajectory and avert from the deflecting
prism, then the flip chip after glue dipping is pre-aligned via the upper vision optical structure. Through the pre-alignment system provided by the invention, the bonding accuracy and efficiency are greatly increased, and the requirements of high-precision chip loading are satisfied.