Solid luminous lamp filament, processing technology and light-emitting diode (LED) lighting device
A processing technology and filament technology, which is applied to lighting devices, lighting device parts, lighting and heating equipment, etc., can solve the problems of complex filament width and structure, complicated filament processing technology, uneven luminous brightness, etc., and achieves strong practicability. , long service life, small size effect
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Embodiment 1
[0053] Such as Figure 1-4 with Picture 12 As shown, the three-dimensional light-emitting filament includes a long strip substrate 1 made of a transparent material or a light-transmitting material. The two ends of the substrate 1 are respectively provided with pads 11, and at least two two wires are provided on one side of the substrate 1. The ends are respectively connected to the bonding pads 11 and arranged in parallel with the curved conductive lines 12, each of the curved conductive lines 12 is provided with a number of LED flip chips 2 and the LED flip chips are arranged on different curved conductive lines 12 The chip 2 is located on the same straight line, the LED flip chip 2 is a blue or violet chip, and the wavelength of the chip is 365-470 nm. When it is a blue chip, the wavelength of the chip is 440-460nm. When it is a purple light chip, the wavelength of the chip is 365-470nm. The structure in which the curved conductive lines 12 arranged in parallel and the LED ...
Embodiment 2
[0073] Such as Figure 16-17 As shown, the structure and principle of this embodiment are basically the same as those of the first embodiment, and will not be repeated here. The difference is that the package structure 3 circumferentially encapsulates the substrate 1 and the package structure 3 and the substrate 1 are connected. Form a flat sheet structure.
Embodiment 3
[0075] The structure and principle of this embodiment are basically the same as those of the first embodiment, and will not be repeated here. The difference is that: the first encapsulation layer 31 includes the following components by mass: 8.5 parts of green phosphor; red phosphor 1.8 parts; 35-40 parts of A glue; 17.5-20 parts of B glue; the green phosphor, red phosphor, A glue and B glue are uniformly mixed to form the first encapsulation layer 31.
[0076] The second encapsulation layer 32 includes the following components in parts by mass: 2.3 parts of green phosphor; 0.4 parts of red phosphor; 35-40 parts of A glue; 17.5-20 parts of B glue; the green phosphor and red phosphor , Glue A and Glue B are uniformly mixed to form the second packaging layer 32.
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