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Solid luminous lamp filament, processing technology and light-emitting diode (LED) lighting device

A processing technology and filament technology, which is applied to lighting devices, lighting device parts, lighting and heating equipment, etc., can solve the problems of complex filament width and structure, complicated filament processing technology, uneven luminous brightness, etc., and achieves strong practicability. , long service life, small size effect

Active Publication Date: 2015-11-11
ZHEJIANG EMITTING OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the filament of this traditional structure has many advantages above, this filament also has the following defects at least: poor luminous brightness and uneven luminance
[0003] Although the above-mentioned schemes each have the above multiple advantages, these several schemes still have at least the following defects: uneven and poor luminance, the width of the filament is wide and the structure is complex, and secondly, the processing technology of the filament is complicated and difficult. less efficient

Method used

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  • Solid luminous lamp filament, processing technology and light-emitting diode (LED) lighting device
  • Solid luminous lamp filament, processing technology and light-emitting diode (LED) lighting device
  • Solid luminous lamp filament, processing technology and light-emitting diode (LED) lighting device

Examples

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Effect test

Embodiment 1

[0053] Such as Figure 1-4 with Picture 12 As shown, the three-dimensional light-emitting filament includes a long strip substrate 1 made of a transparent material or a light-transmitting material. The two ends of the substrate 1 are respectively provided with pads 11, and at least two two wires are provided on one side of the substrate 1. The ends are respectively connected to the bonding pads 11 and arranged in parallel with the curved conductive lines 12, each of the curved conductive lines 12 is provided with a number of LED flip chips 2 and the LED flip chips are arranged on different curved conductive lines 12 The chip 2 is located on the same straight line, the LED flip chip 2 is a blue or violet chip, and the wavelength of the chip is 365-470 nm. When it is a blue chip, the wavelength of the chip is 440-460nm. When it is a purple light chip, the wavelength of the chip is 365-470nm. The structure in which the curved conductive lines 12 arranged in parallel and the LED ...

Embodiment 2

[0073] Such as Figure 16-17 As shown, the structure and principle of this embodiment are basically the same as those of the first embodiment, and will not be repeated here. The difference is that the package structure 3 circumferentially encapsulates the substrate 1 and the package structure 3 and the substrate 1 are connected. Form a flat sheet structure.

Embodiment 3

[0075] The structure and principle of this embodiment are basically the same as those of the first embodiment, and will not be repeated here. The difference is that: the first encapsulation layer 31 includes the following components by mass: 8.5 parts of green phosphor; red phosphor 1.8 parts; 35-40 parts of A glue; 17.5-20 parts of B glue; the green phosphor, red phosphor, A glue and B glue are uniformly mixed to form the first encapsulation layer 31.

[0076] The second encapsulation layer 32 includes the following components in parts by mass: 2.3 parts of green phosphor; 0.4 parts of red phosphor; 35-40 parts of A glue; 17.5-20 parts of B glue; the green phosphor and red phosphor , Glue A and Glue B are uniformly mixed to form the second packaging layer 32.

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Abstract

The invention relates to a solid luminous lamp filament, a processing technology and a light-emitting diode (LED) lighting device, and aims at solving the problems that an existing design is unreasonable and the like. The solid luminous lamp filament comprises a substrate, wherein the substrate is in a strip, and is made of a transparent material or a translucent material; bonding pads are respectively arranged at two ends of the substrate; at least two bent conducting circuits of which two ends are respectively connected with the bonding pads and are arranged in parallel are arranged at one surface of the substrate; a plurality of LED flip chips are respectively arranged on each bent conducting circuit; the LED flip chips arranged on different bent conducting circuits are located on the same straight line; and a packaging structure is arranged in the circumference of the substrate. The processing technology of the solid luminous lamp filament comprises the following steps: A, positioning; B, pre-bending; C, riveting; D, surface mounting; and E, packaging. The LED lighting device comprises a carrying base body; and at least one solid luminous lamp filament is arranged on the carrying base body. The solid luminous lamp filament has the advantages that the solid luminous lamp filament is uniform in illumination brightness and long in service life, and the production efficiency is improved.

Description

Technical field [0001] The invention belongs to the technical field of lighting equipment, and in particular relates to a three-dimensional luminous filament, a processing technology and an LED lighting device. Background technique [0002] The traditional filaments are metal filaments and mostly thin tungsten filaments, and iridium or their alloys are also used. When energized, they can directly emit light, generate heat, or emit electrons, ultraviolet rays, form high-energy electric fields, or generate high-energy rays to excite fluorescent substances, rare gases, or Plasma is formed, etc., producing various colors of visible light. Although the filament of this traditional structure has many of the above advantages, it still has at least the following defects: poor luminous brightness and uneven luminous brightness. For example, the Chinese patent document discloses an LED filament [application number: 201320674278.8], including: a substrate, a plurality of chips fixed on the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/62F21S2/00F21V19/00F21Y101/02
Inventor 邹军李杨杨磊李文博
Owner ZHEJIANG EMITTING OPTOELECTRONICS TECH