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Heat-insulating molding compound, heat-insulating molded article, and production method for same

A formed body and heat insulation technology, which is applied in the directions of heat exchange equipment, chemical instruments and methods, mechanical equipment, etc., can solve the problems of application field limitation, time-deteriorated preparation cost, and limitation of heat insulators, etc.

Inactive Publication Date: 2015-11-11
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the vacuum-based insulation method needs to maintain a vacuum state, and thus has problems of deterioration over time and manufacturing cost
Also, in vacuum-based insulators, since it needs to maintain a vacuum state, the shape of the insulator is limited, so its application field is also severely limited
For these reasons, the vacuum-based insulators are limited in practical application

Method used

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  • Heat-insulating molding compound, heat-insulating molded article, and production method for same
  • Heat-insulating molding compound, heat-insulating molded article, and production method for same
  • Heat-insulating molding compound, heat-insulating molded article, and production method for same

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Embodiment

[0072] Hereinafter, the present invention is specifically described with reference to Examples.

[0073] Preparation method of airgel particles

[0074] Prepare tetramethoxysilane oligomer ("methyl silicate 51", purchased from COLCOATCO., Ltd., its average molecular weight is 470) as alkoxysilane, ethanol (special grade reagent, purchased from nacalaitesqueinc.) and water As a solvent, and 0.01mol / l ammonia water as a catalyst. Mix 1 mol of tetramethoxysilane oligomer, 120 mol of ethanol, 20 mol of water and 2.16 mol of ammonia water to prepare a sol-like reaction solution.

[0075] Thereafter, the sol-like reaction solution was put into a bottle, and then left to gel at normal temperature to produce a gelled compound.

[0076] Then, put the above-mentioned gelled compound into a place filled with liquefied carbon dioxide at a temperature of 18°C ​​and a pressure of 5.4MPa (55kgf / cm 2 ) in a pressure vessel, and the ethanol in the gelled compound was replaced by carbon diox...

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Abstract

Provided is a heat-insulating molding compound with which heat-insulating molded articles of high strength and exceptional heat insulating properties can be produced. The compound is formed by crushing aerogel particles (A) coated with an adhesive (4).

Description

technical field [0001] The present invention relates to airgel particle-based heat-insulating shaped materials, heat-insulated shaped bodies and methods for their production. Background technique [0002] As the heat insulator, foam materials such as polyurethane foam and phenolic foam (foam-based heat insulator) are known. The insulating properties exhibited by the foam are due to the air bubbles produced by the foaming. However, such polyurethane foams and phenolic foams generally have a thermal conductivity higher than that of air. Therefore, it is beneficial to further improve the thermal insulation performance by making the thermal conductivity of the thermal insulator smaller than that of air. As a method of obtaining a thermal conductivity smaller than that of air, there is known a method of filling air gaps of foamed materials such as polyurethane foam and phenolic foam with a gas having low thermal conductivity such as chlorofluorocarbons or the like. However, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16L59/04C01B33/158C01B33/18
CPCC01B33/159C01B33/1585C01B33/158C01B33/18F16L59/04F16L59/028
Inventor 日高康博柴田哲司细井健太安藤秀行钉宫一真生驹善光
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD