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Pedestal of laser packaging equipment and laser packaging equipment

A laser packaging and equipment technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as cracks in glass substrates and glass powder, decreased durability of glass substrates, and defective products, so as to improve the yield rate , reduce the crack phenomenon, slow down the effect of loss speed

Active Publication Date: 2015-11-18
BOE TECH GRP CO LTD
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Problems solved by technology

[0005] However, since the OLED substrate is in direct contact with the base, and the base is made of metal material, when the laser scans the glass powder, the heat conducted by the laser is quickly transferred to the base, and the temperature of the glass powder drops quickly. After being irradiated, it is cooled rapidly, and there is a problem that the glass substrate and glass powder are impacted by rapid temperature changes and the probability of cracks increases.
In addition, even if no cracks occur, there is a problem of defective products due to the decrease in the durability of the glass substrate.

Method used

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  • Pedestal of laser packaging equipment and laser packaging equipment
  • Pedestal of laser packaging equipment and laser packaging equipment
  • Pedestal of laser packaging equipment and laser packaging equipment

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of patent protection of the present invention.

[0029] Such as figure 1 and figure 2 shown, where: figure 1 A schematic diagram of a cross-sectional structure of a base of a laser packaging device provided by an embodiment of the present invention; figure 2 A schematic diagram of a cross-sectional structure of the base of the laser packaging device provided in the embodiment of the present invention when used in conjunction with the substrate 2 to be packaged; the present invention provides a ...

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Abstract

The invention relates to the preparation technical field of display apparatuses and discloses a pedestal of laser packaging equipment and laser packaging equipment. The pedestal of the laser packaging equipment comprises a metal pedestal body; the metal pedestal body is used for supporting one side of a to-be-packaged substrate; and an insulation structure which is in one-to-one correspondence with a glass powder area of each sub-substrate in the to-be-packaged substrate is provided. According to the pedestal of the laser packaging equipment provided by the invention, the insulation structures are arranged on the metal pedestal body, so that the losing speed of heat which is transmitted to glass powder by the laser is reduced, rapid change in the temperature of the glass powder and the glass substrate is prevented, the crack is further reduced after the to-be-packaged substrate and the glass powder are packaged, and the packaging yield is improved.

Description

technical field [0001] The invention relates to the technical field of display device preparation, in particular to a base of laser packaging equipment and the laser packaging equipment. Background technique [0002] In recent years, OLED (Organic Light-Emitting Diode, English full name: Organic Light-Emitting Diode) has been more and more widely used in the field of flat panel display and lighting. Because the life of the OLED chip is easily affected by oxygen and water vapor, the infiltration of water vapor and oxygen will cause effects such as cathode oxidation, film removal, and organic layer crystallization in the OLED device, resulting in premature aging or even damage to the device. The common phenomenon is black spots. , pixelshrinkage (pixel shrinkage) and light intensity attenuation, according to the process requirements of OLED, the encapsulation of OLED devices can not only enhance the mechanical strength of the device, but more importantly, it can isolate the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56
CPCC03C8/24B23K26/00H10K71/00H10K50/841H10K50/8426
Inventor 李艺
Owner BOE TECH GRP CO LTD
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