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Contact resistance measuring method and structure

A technology of contact resistance and test structure, which is applied in the direction of measuring resistance/reactance/impedance, measuring devices, measuring electrical variables, etc., can solve problems such as high work cost, unreliable contact between probes and corresponding pads, and consume a lot of time. Achieve the effect of reducing work costs, saving test time and test samples

Inactive Publication Date: 2015-11-25
SEMICON MFG INT (SHANGHAI) CORP
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  • Application Information

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Problems solved by technology

[0003] Disadvantages in the prior art: Since the contact resistance between the probe and its corresponding pad is very small, the contact between the probe and the corresponding pad is not reliable, and the corresponding contact resistance is correspondingly small
This makes it necessary for the staff to spend a lot of time and samples for repeated testing when it is necessary to detect the contact resistance of the probe in the prior art to obtain more accurate experimental data, resulting in higher work costs

Method used

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  • Contact resistance measuring method and structure
  • Contact resistance measuring method and structure
  • Contact resistance measuring method and structure

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Embodiment Construction

[0026] It should be noted that, in the case of no conflict, the implementations in the present application and the features in the implementations can be combined with each other. Hereinafter, the present application will be described in detail with reference to the accompanying drawings and in combination with embodiments.

[0027] Embodiments of the present application provide a method for measuring contact resistance, which is used to test the contact resistance between a probe and a pad in a hot carrier injection experiment. figure 1 with figure 2 The test principle of the two steps of the test method is shown, and the above-mentioned method for measuring the contact resistance includes the first step and the second step. The first step includes: S11, setting a resistor R between two adjacent welding pads during the manufacturing process. S12. Apply a first voltage V to two adjacent pads and measure a corresponding first current I. S13. Calculate the total resistance b...

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Abstract

The invention provides a contact resistance measuring method and structure used for measuring contact resistance between a probe and a welding pad in a hot carrier injection experiment. The method includes steps of arranging a resistor R between two adjacent welding pads; applying a voltage V on the two adjacent welding pads and measuring the corresponding first current I; calculating the total resistance between the two adjacent welding pads according the first voltage V and the first current I; applying a second current I' on a welding pad adjacent to the two adjacent welding pads and measuring a second voltage V' corresponding to the resistor R; calculating the magnitude of the resistor R according to the second voltage V' and the second current I'; and calculating the magnitude of the contact resistor according to the total resistance and the magnitude of the resistor R. By adopting the measuring method provided by the invention, the magnitude of the contact resistance is calculated by utilizing difference values, so that measurement time and measurement samples can be saved and an aim of reducing working cost can be realized.

Description

technical field [0001] The application relates to the field of resistance testing, in particular to a testing method and testing structure of contact resistance. Background technique [0002] The hot carrier injection experiment in the prior art is a very time-consuming primary reliability experiment. In this experiment, the contact between the probe and the gasket has a great influence on the experiment and the final result. When the contact of the probe is not reliable, the parameters of the electrical signal obtained in the experiment will change accordingly. Whether the probe and its corresponding pad are in reliable contact can be judged by the contact resistance between the probe and its corresponding pad. [0003] Disadvantages in the prior art: Since the contact resistance between the probe and the corresponding pad is very small, the contact between the probe and the corresponding pad is not reliable, and the corresponding contact resistance is correspondingly smal...

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Application Information

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IPC IPC(8): G01R27/08
Inventor 单文光周华阳宋永梁
Owner SEMICON MFG INT (SHANGHAI) CORP