Wafer calibration device and semiconductor processing equipment
A wafer calibration, wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of large data processing and calibration of processing units, increase the difficulty of implementation, increase hardware costs, etc., to reduce equipment and Production cost, burden reduction, effect of production cost reduction
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2015-11-25
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor processing, in particular to a wafer alignment device and semiconductor processing equipment. Background technique
[0002] In the semiconductor manufacturing process, it is necessary to gradually transfer the wafer to be processed from the atmosphere to a vacuum chamber for processes such as etching and deposition. This requires a wafer transfer system consisting of a series of atmospheric equipment and vacuum equipment. For example, it is usually necessary to use a manipulator to carry out the operations of transferring, picking up and placing the wafers, so as to realize the transfer, loading and unloading of the wafers. In order to ensure the stability of the process, it is required that the wafer can be accurately transferred to the designated position. Although the theoretical transfer accuracy of the current manipulator can meet the process requirements, in the actual transfer proces...
Examples
Embodiment Construction
[0030] In order for those skilled in the art to better understand the technical solution of the present invention, the wafer alignment device and semiconductor processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0031] Figure 4A It is a sectional view of the wafer alignment device provided by the first embodiment of the present invention. Figure 4B for along Figure 4A Sectional view of line A-A. Please also refer to Figure 4A and 4B , the wafer alignment device includes a vacuum chamber 20, a carrier, a rotating mechanism, a light source 23, and a light receiving and processing device. Wherein, the carrier includes a rotating platform 22 and three supporting columns 21, wherein the rotating platform 22 is arranged in the vacuum chamber 20; the three supporting columns 21 are fixed on the rotating platform 22, and are distributed at intervals along its circumference; and, The tops of ...