A heat dissipation device that adopts pulsating flow and foam metal plate to strengthen

Abstract

The invention discloses a device for strengthening heat dissipation by adopting pulsating flow and foamed metal plates, which comprises a pulsating pump, a heat sink chamber, a liquid accumulation chamber and a cooler. The liquid accumulation chamber sprays the cooling liquid into the heat sink chamber through the liquid separator, and the heat sink chamber sends the heat-exchanged liquid into the cooler through the liquid discharge pipe for cooling, and the pulsation pump sucks the cooled cooling liquid from the cooler through the connecting pipe. liquid; the heat sink chamber includes a foamed metal plate, a heat exchange carrier plate and a cover plate, the heat exchange carrier plate is connected to a high heat flux device, the foam metal plate is fixedly connected to the heat exchange carrier plate, and the liquid separator is connected to the heat exchange carrier plate The top of the cover plate is connected vertically. The pulsating flow in the present invention combined with the double-layer metal foam structure can increase the horizontal and vertical disturbance and mixing of the working fluid, and the thermal boundary layer is continuously reorganized. At the same time, the pressure change will lead to the formation of cavitation and vortex during the disturbance process. , can greatly improve the heat transfer efficiency.

Description

technical field [0001] The invention relates to a heat dissipation device enhanced by adopting pulsating flow and a foam metal plate, which belongs to the field of industrial heat dissipation. Background technique [0002] In recent years, due to the rapid development of industry, the requirements for heat dissipation and heat exchange of electronic equipment have become higher and higher, and the heating power has exceeded 100W / cm 2 . According to the current research, the heat dissipation of electronic chips mainly adopts air cooling, liquid cooling, heat pipes and microchannels. The air-cooled heat dissipation method is difficult to meet the challenges of high heat flux density devices; the heat pipe heat dissipation module is limited by phenomena such as the carrying limit and the dry limit; for liquid cooling and heat dissipation, it is generally carried out under steady-state conditions. Contents of the invention [0003] Purpose of the invention: In order to overc...

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Problems solved by technology

The air-cooled heat dissipation method is difficult to cope with the challenges of high heat flux density devices; the heat pipe heat dissipation module is limited by phenomena such as the carrying limit and the dry limit; for liquid cooling heat dissipation, it is generally carried out under steady-state conditions

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