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Smart card chip packaging structure and packaging method

A smart card chip and packaging structure technology, applied in the field of smart cards, can solve the problems of excessive chip area and high cost, and achieve the effect of shrinking chip area, increasing utilization rate, and improving product performance

Active Publication Date: 2018-07-06
立联信(上海)微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its disadvantage is that the chip area is too large and the cost is too high

Method used

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  • Smart card chip packaging structure and packaging method
  • Smart card chip packaging structure and packaging method
  • Smart card chip packaging structure and packaging method

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The specific implementation of the smart card chip packaging structure and packaging method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0027] see Figure 4 and Figure 5 , The first embodiment of a smart card chip packaging structure of the present invention includes a substrate 40 and a flip chip 41 flip-chip soldered to the substrate 40 .

[0028] Some pins of the flip chip 41 are flip-chip soldered to the substrate 40 . In this specific embodiment, a part of the pins of the flip chip 41 is implanted with solder balls 42, and the flip chip 41 is turned over so that the solder balls 42 are in contact with the substrate 40, and the solder balls 42 are melted. Some pins of the flip chip 41 are fixed and electrically connected to the substrate 40 through solder balls 42 .

[0029] At least one welding pad 43 is provided on the substrate 40, and the welding pad 43 is exposed outside the flip chip ...

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Abstract

The present invention provides a smart card chip packaging structure and packaging method. The packaging structure includes a substrate and a flip chip that is flip-chip welded to the substrate. A part of the pins of the flip chip are flip-chip welded to the substrate. At least one soldering pad is provided on the substrate, and the soldering pad is exposed to the outside of the flip chip. Pad electrical connection. The present invention has the advantages of adopting flip-chip packaging and wire-bonding packaging at the same time. Compared with flip-chip welding, the chip area is reduced, which is conducive to reducing costs. Compared with pure wire-bonding packaging, the utilization rate of the chip is improved. improve.

Description

technical field [0001] The invention relates to the field of smart cards, in particular to a smart card chip packaging structure and packaging method. Background technique [0002] At present, the packaging of smart card chips mainly has the following two methods. [0003] see figure 1 One way is wire bonding, which is a kind of use of thin metal wires 10, using heat, pressure, and ultrasonic energy to make the metal wires 10 and the pads 11 of the substrate 13 tightly welded, so as to realize the bonding between the chip 12 and the substrate 13. Electrical interconnection and information exchange between chips. Under ideal control conditions in this packaging method, electron sharing or mutual diffusion of atoms will occur between the lead and the substrate, so that the bonding between the two metals can be achieved at the atomic level. However, its disadvantage is that the chip area is limited and it is difficult to meet complex functions. [0004] see figure 2 and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/49H01L21/60
CPCH01L2224/16245H01L2224/48091H01L2224/49171H01L2224/73257H01L2924/00014
Inventor 高洪涛陆美华刘玉宝沈爱明张立
Owner 立联信(上海)微电子科技有限公司