LED light source substrate, method for manufacturing LED light source substrate and LED light source
A technology of LED light source and LED chip, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor heat dissipation of LED light source substrates, affecting the performance and life of LED light sources, etc., to achieve stable performance parameters, increase service life, and save energy. cost effect
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Embodiment 1
[0053] This embodiment provides an LED light source substrate, such as figure 2 As shown, it includes a substrate 10 with at least three heat dissipation structures, wherein the LED chip area ( figure 2 The thermal conductivity of the heat dissipation structure corresponding to the dotted line area in the center is greater than that of other heat dissipation structures; the copper foil layer 20 on the surface of the substrate, the reflective layer 30 and the insulating layer 40 on the surface of the copper foil layer.
[0054] Such as image 3 As shown, the substrate 10 has at least three heat dissipation structures: a first heat dissipation structure 101, a second heat dissipation structure 102, and a third heat dissipation structure 103. Arrangement, that is, the first heat dissipation structure 101 is a circular area located in the center, the second heat dissipation structure 102 is a ring located around the first heat dissipation structure 101, and the third heat dissi...
Embodiment 2
[0063] This embodiment provides a method for manufacturing an LED light source substrate, such as Figure 4 shown, including:
[0064] S41: At least three heat dissipation structures are sequentially formed by using an injection molding process to form the base of the heat dissipation structure corresponding to the predetermined LED chip area, whose thermal conductivity is greater than that of other heat dissipation structures;
[0065] In this embodiment, at least three heat dissipation structures include: a first heat dissipation structure, a second heat dissipation structure, and a third heat dissipation structure that are concentric rings and arranged outwards along the center of the circle, and the materials of these three heat dissipation structures and the base It is thermally conductive plastic PA, and the content of high thermally conductive fibrous carbon powder in the materials of different heat dissipation structures is different, so that different heat dissipation...
Embodiment 3
[0080] This embodiment provides an LED light source, including the LED light source substrate provided in any one of the above embodiments, wherein the LED chip is located in the preset LED chip area of the LED light source substrate, and the preset LED chip of the LED light source substrate The thermal conductivity of the heat dissipation structure corresponding to the region is greater than that of other heat dissipation structures.
[0081] In the LED light source provided in this embodiment, the substrate has at least three heat dissipation structures, and the thermal conductivity of the heat dissipation structure corresponding to the preset LED chip area is greater than that of other heat dissipation structures, so that the heat generated by the LED chip can be dissipated to the greatest extent, improving the The heat dissipation capability of the LED light source substrate stabilizes the performance parameters of the LED light source and increases the service life of th...
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