Copper powder used for ultrathin vapor chamber and manufacturing method thereof

Abstract

The invention relates to copper powders and a manufacturing method thereof, and especially relates to copper powders used for an ultrathin vapor chamber and a manufacturing method thereof. The shape of a copper powder particle is spherical or spherical-like. The copper powder particles are in a single particle non-spheroidizing structure. Particle size range of the copper powders is 1-100 [mu]m. Apparent density of the copper powders is 2.0-5.0 g / cm<3>. The shape of the copper powder particle is spherical or spherical-like. The spherical copper powder has excellent mobility, and powders can be filled uniformly and densely without powder filling defects in a vapor chamber powder filling process. The copper powders have capillary organization in relatively high porosity. The porosity of the capillary organization is higher than 65%.

Description

technical field [0001] The technology of the invention relates to a copper powder and a production method thereof, in particular to a copper powder for an ultra-thin vapor chamber and a production method thereof. Background technique [0002] With the rapid development of microelectronics technology, the feature size of electronic devices has been continuously reduced, and the integration level, packaging density and operating frequency of chips have been continuously improved, all of which make the heat flux of chips increase rapidly. The heat pipe has extremely high thermal conductivity and does not require additional energy. It is a green and environmentally friendly heat dissipation technology. Compared with ordinary heat pipes, the vapor chamber (VaporChamber) has more prominent advantages. The thickness of the plate has also developed from the initial minimum of 3mm to the current less than 1mm. After the vapor chamber is thinned, it is difficult to arrange the capilla...

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Problems solved by technology

The heat pipe has extremely high thermal conductivity and does not require additional energy. It is a green and environmentally friendly heat dissipation technology. Compared with ordinary heat pipes, the vapor chamber (VaporChamber) has more prominent advantages. The thickness of the plate has also developed from the initial minimum of 3mm to the current less than 1mm. After the vapor chamber is thinned, it is difficult to arrange the capillary structure, and the shortcomings such as the decline of the capillary force begin to appear. The traditionally used copper wire mesh cannot meet the demand for high power.

[0003] Using copper wire mesh as the capillary structure of the ultra-thin vapor chamber has low capillary force, and the power of the vapor chamber is insufficient; when using the existing copper powder as the capillary structure of the ultra-thin vapor chamber, the porosity of the capillary structure after copper powder sintering will be insufficient Or the problem that the capillary structure is too thick due to the coarse copper powder particles

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