Copper powder used for ultrathin vapor chamber and manufacturing method thereof

A manufacturing method and technology for a soaking plate are applied in the field of copper powder for an ultra-thin soaking plate and its production, which can solve the problems of insufficient capillary porosity, decreased capillary force, insufficient power of the soaking plate, etc., and achieve no powder filling. The effect of defects, uniform and dense powder filling, excellent flowability

Active Publication Date: 2015-12-02
SCM METAL PROD SUZHOU
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

The heat pipe has extremely high thermal conductivity and does not require additional energy. It is a green and environmentally friendly heat dissipation technology. Compared with ordinary heat pipes, the vapor chamber (VaporChamber) has more prominent advantages. The thickness of the plate has also developed from the initial minimum of 3mm to the current less than 1mm. After the vapor chamber is thinned, it is difficult to arrange the capillary structure, and the shortcomings such as the decline of the capillary force begin to ap

Method used

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  • Copper powder used for ultrathin vapor chamber and manufacturing method thereof
  • Copper powder used for ultrathin vapor chamber and manufacturing method thereof
  • Copper powder used for ultrathin vapor chamber and manufacturing method thereof

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Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the examples and experimental test results.

[0020] The detection method of the present invention is: use the copper powder to prepare a sample and sinter to form a capillary structure, and then detect the connected porosity and water absorption flux of the capillary structure.

[0021] Capillary connected porosity is referred to as capillary connectivity, which refers to the ratio of the volume of pores in the capillary structure that can communicate with the outside world to the total volume of the capillary structure. The sample preparation method and calculation method are:

[0022] Put the copper powder into the cuboid graphite box mold, the size of the graphite box mold powder filling space is A*B*C, put the mold filled with the powder sample into the sintering furnace for sintering, the sintering temperature is 980±2 degrees for 30 minutes, and sintering After the completion, a c...

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Abstract

The invention relates to copper powders and a manufacturing method thereof, and especially relates to copper powders used for an ultrathin vapor chamber and a manufacturing method thereof. The shape of a copper powder particle is spherical or spherical-like. The copper powder particles are in a single particle non-spheroidizing structure. Particle size range of the copper powders is 1-100 [mu]m. Apparent density of the copper powders is 2.0-5.0 g/cm<3>. The shape of the copper powder particle is spherical or spherical-like. The spherical copper powder has excellent mobility, and powders can be filled uniformly and densely without powder filling defects in a vapor chamber powder filling process. The copper powders have capillary organization in relatively high porosity. The porosity of the capillary organization is higher than 65%.

Description

technical field [0001] The technology of the invention relates to a copper powder and a production method thereof, in particular to a copper powder for an ultra-thin vapor chamber and a production method thereof. Background technique [0002] With the rapid development of microelectronics technology, the feature size of electronic devices has been continuously reduced, and the integration level, packaging density and operating frequency of chips have been continuously improved, all of which make the heat flux of chips increase rapidly. The heat pipe has extremely high thermal conductivity and does not require additional energy. It is a green and environmentally friendly heat dissipation technology. Compared with ordinary heat pipes, the vapor chamber (VaporChamber) has more prominent advantages. The thickness of the plate has also developed from the initial minimum of 3mm to the current less than 1mm. After the vapor chamber is thinned, it is difficult to arrange the capilla...

Claims

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Application Information

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IPC IPC(8): B22F9/08B22F1/00
Inventor 胡立荣向雄海唐波
Owner SCM METAL PROD SUZHOU
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