A kind of potting glue and preparation method thereof

A technology of potting glue and bisphenol, which is applied in the direction of adhesive, epoxy glue, adhesive type, etc., to achieve the effect of small gap permeability, fast flow speed and excellent adhesion

Inactive Publication Date: 2017-05-24
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is not suitable for potting components with complex structures and gaps and circuit boards under the gaps

Method used

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  • A kind of potting glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Accurately weigh the following raw materials, bisphenol A epoxy resin (E51) 50g, n-butyl glycidyl ether agent 7.5g, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane 2g, Put 0.5g of carbon black into the reactor, mix at room temperature for 30 minutes, then weigh 5g of TATSUMORI’s XR-08P, TSS-6 25g into the reactor, mix at room temperature for 3 hours, then weigh 10g of ADEKA’s EH-4360s, Put it into the reaction kettle, stir and mix for 1 hour at a temperature of 25°C, a vacuum of -0.07MPa, and a rotation speed of 800 rpm to obtain the product.

Embodiment 2

[0024] Accurately weigh the following raw materials, 30g of novolac epoxy resin (F51), 10g of tert-butyl glycidyl ether, 5g of γ-glycidyloxypropyltrimethoxysilane, and 0.5g of carbon black, and put them into the reaction kettle. Mix at low temperature for 30 minutes, then weigh 5g of TATSUMORI’s XR-18P and 40g of TSS-6 into the reactor, mix at room temperature for 3 hours, then weigh 9.5g of ADEKA’s EH-43709. The temperature is -0.07MPa, the speed is 800 rpm, and the mixture is stirred for 1 hour to obtain the product.

Embodiment 3

[0026] Accurately weigh the following raw materials, 60g of bisphenol F epoxy resin (862), 2g of o-cresyl glycidyl ether, 0.5g of γ-mercaptopropyltrimethoxysilane, and 0.5g of carbon black were put into the reaction kettle, Mix at low temperature for 30 minutes, then weigh 2g of XR-08P and 13g of XR-18P from TATSUMORI and put them into the reactor, mix at room temperature for 3 hours, then weigh 22g of EH-3293s from ADEKA, add them to the reactor, at a temperature of 25°C, vacuum The temperature is -0.07MPa, the speed is 800 rpm, and the mixture is stirred for 1 hour to obtain the product.

[0027] Specific test examples

[0028] The performances of the above-mentioned Examples 1-3 of the present invention and the commercially available potting compound were tested by the following test.

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Abstract

The invention relates to a potting glue and a preparation method thereof, which is composed of the following raw materials by weight percentage: 30-60% of epoxy resin, 2-10% of diluent, 0.5-5% of silane coupling agent, and 9.5-5% of curing agent. 22%, compound silicon powder 15% to 45%, carbon black 0.5%. The potting glue of the invention has the advantages of fast flow speed, good defoaming property, small gap permeability and excellent adhesiveness, so that the appearance of the encapsulated components is smooth and high reliability. It is especially suitable for the potting of components with complex structure with gaps and circuit boards under the gaps.

Description

technical field [0001] The invention relates to a potting glue and a preparation method thereof, which are suitable for potting and protecting electronic components such as automobiles and electric vehicle motors, and belong to the field of adhesives. Background technique [0002] With the rapid development of the electronics industry, the closely related electronic packaging technology is becoming more and more advanced. Intelligence, light weight, small size, fast speed, strong function, and good reliability have become the main development trends of electronic products. Potting adhesives are used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06
Inventor 王红娟王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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