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Metal nitride material for thermistor, method for producing the same, and thin-film thermistor sensor

A technology of thermistor and manufacturing method, applied in the thermistor, coating resistance material, metal material coating process and other directions, can solve the problems of lack of heat resistance, inability to achieve, unable to ensure heat resistance, etc. The effect of high heat resistance

Active Publication Date: 2018-04-03
MITSUBISHI MATERIALS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the thermistor material has a B constant of about 500 to 3000K in the examples of the Ta-Al-N-based material, but there is no description about heat resistance, and the thermal stability of the nitride-based material is reliable. gender ambiguity
[0013] In addition, the Cr-N-M-based material of Patent Document 5 is a material with a small B constant of 500 or less, and if heat treatment at 200°C to 1000°C is not performed, heat resistance within 200°C cannot be ensured, so there is a problem that it cannot Problems in Realizing Thin-Film Thermistor Sensors Directly Formed on Thin Films

Method used

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  • Metal nitride material for thermistor, method for producing the same, and thin-film thermistor sensor
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  • Metal nitride material for thermistor, method for producing the same, and thin-film thermistor sensor

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Embodiment

[0108] Next, regarding the metal nitride material for thermistors and its manufacturing method and thin-film thermistor sensor according to the present invention, refer to Figure 6 to Figure 34 , and specifically describe the results of evaluation based on the examples prepared according to the above-mentioned embodiment.

[0109]

[0110] As examples and comparative examples of the present invention, the following Image 6 Element 121 is shown for film evaluation.

[0111] First, by reactive sputtering method, using various composition ratios of Ti-V-Al alloy targets, Cr-V-Al alloy targets and Ti-Cr-V-Al alloy targets, thermal oxidation of Si substrate S Thin film thermistor part 3 of metal nitride material for thermistor formed in various composition ratios shown in Table 1 to Table 3 with a thickness of 500 nm was formed on the Si wafer of the thin film. The sputtering condition at this time is the ultimate vacuum degree: 5×10 -6 Pa, sputtering pressure: 0.1~1Pa, targ...

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Abstract

Provided are a metal nitride material for a thermistor, which has a high heat resistance and a high reliability and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: (M1−vVv)xAly(N1−wOw)z (where 0.0<v<1.0, 0.70≦y / (x+y)≦0.98, 0.45≦z≦0.55, 0<w≦0.35, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase, and “M” is one or two elements selected from Ti and Cr. The method includes a deposition step of performing film deposition by reactive sputtering in a nitrogen and oxygen-containing atmosphere using an M-V—Al alloy sputtering target, wherein “M” is one or two elements selected from Ti and Cr.

Description

technical field [0001] The present invention relates to a metal nitride material for a thermistor that can be directly formed on a thin film or the like under non-firing conditions, a method for producing the same, and a thin film thermistor sensor. Background technique [0002] Thermistor materials used in temperature sensors etc. require a high B constant for high precision and high sensitivity. Conventionally, such thermistor materials are generally transition metal oxides such as Mn, Co, and Fe (refer to Patent Documents 1 to 3). In addition, these thermistor materials require heat treatment such as firing at 550° C. or higher in order to obtain stable thermistor characteristics. [0003] And, in addition to the thermistor material composed of the above-mentioned metal oxide, for example, in Patent Document 4, it is proposed that the general formula: M x A y N z (Wherein, M represents at least one of Ta, Nb, Cr, Ti and Zr, and A represents at least one of Al, Si and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04C01G31/00C23C14/06C23C14/34C30B29/38G01K7/22H01C17/12
CPCC23C14/0036C23C14/0676C30B29/38G01K7/22H01C7/006H01C7/008H01C7/04H01C17/12
Inventor 藤田利晃田中宽长友宪昭
Owner MITSUBISHI MATERIALS CORP
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