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Metal nitride material for thermistors, method for producing same, and film-type thermistor sensor

A technology of thermistor and manufacturing method, which is applied in the direction of thermistor, coating resistance material, metal material coating process, etc., can solve the problems of lack of heat resistance, inability to ensure heat resistance, and impracticability, etc., to achieve The effect of high heat resistance

Active Publication Date: 2015-12-09
MITSUBISHI MATERIALS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the thermistor material has a B constant of about 500 to 3000K in the examples of the Ta-Al-N-based material, but there is no description about heat resistance, and the thermal stability of the nitride-based material is reliable. gender ambiguity
[0013] In addition, the Cr-N-M-based material of Patent Document 5 is a material with a small B constant of 500 or less, and if heat treatment at 200°C to 1000°C is not performed, heat resistance within 200°C cannot be ensured, so there is a problem that it cannot Problems in Realizing Thin-Film Thermistor Sensors Directly Formed on Thin Films

Method used

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  • Metal nitride material for thermistors, method for producing same, and film-type thermistor sensor
  • Metal nitride material for thermistors, method for producing same, and film-type thermistor sensor
  • Metal nitride material for thermistors, method for producing same, and film-type thermistor sensor

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Embodiment

[0108] Next, regarding the metal nitride material for thermistors and its manufacturing method and thin-film thermistor sensor according to the present invention, refer to Figure 6 to Figure 34 , and specifically describe the results of evaluation based on the examples prepared according to the above-mentioned embodiment.

[0109]

[0110] As examples and comparative examples of the present invention, the following Figure 6 Element 121 is shown for film evaluation.

[0111] First, by reactive sputtering method, using various composition ratios of Ti-V-Al alloy targets, Cr-V-Al alloy targets and Ti-Cr-V-Al alloy targets, thermal oxidation of Si substrate S Thin film thermistor part 3 of metal nitride material for thermistor formed in various composition ratios shown in Table 1 to Table 3 with a thickness of 500 nm was formed on the Si wafer of the thin film. The sputtering condition at this time is the ultimate vacuum degree: 5×10 -6 Pa, sputtering pressure: 0.1~1Pa, tar...

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Abstract

Provided are: a metal nitride material for thermistors that has high heat resistance, is highly reliable, and can be formed into a film directly on, e.g., a film without firing; a method for producing said metal nitride material; and a film-type thermistor sensor. This metal nitride material used for thermistors is made of a metal nitride represented by the general formula (M1-vVv)xAly(N1-wOw)z (wherein 0.0 < v < 1.0, 0.70 ≤ y / (x+y) ≤ 0.98, 0.45 ≤ z ≤ 0.55, 0 < w ≤ 0.35, and x+y+z = 1), and has a single-phase wurtzite hexagonal crystal structure, wherein said M is Ti and / or Cr. This method for producing said metal nitride material for thermistors comprises a film formation step for forming a film by performing reactive sputtering in a nitrogen- and oxygen-containing atmosphere by using an M-V-Al alloy sputtering target, wherein said M is Ti and / or Cr.

Description

technical field [0001] The present invention relates to a metal nitride material for a thermistor that can be directly formed on a thin film or the like under non-firing conditions, a method for producing the same, and a thin film thermistor sensor. Background technique [0002] Thermistor materials used in temperature sensors etc. require a high B constant for high precision and high sensitivity. Conventionally, such thermistor materials are generally transition metal oxides such as Mn, Co, and Fe (refer to Patent Documents 1 to 3). In addition, these thermistor materials require heat treatment such as firing at 550° C. or higher in order to obtain stable thermistor characteristics. [0003] And, in addition to the thermistor material composed of the above-mentioned metal oxide, for example, in Patent Document 4, it is proposed that the general formula: M x A y N z (Wherein, M represents at least one of Ta, Nb, Cr, Ti and Zr, and A represents at least one of Al, Si and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/04C01G31/00C23C14/06C23C14/34C30B29/38G01K7/22H01C17/12
CPCH01C17/12C23C14/0036C23C14/0676C30B29/38G01K7/22H01C7/006H01C7/008H01C7/04
Inventor 藤田利晃田中宽长友宪昭
Owner MITSUBISHI MATERIALS CORP
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