Soldering-resistance conductive thin film on surface of sensitive structure of space electrostatic accelerometer and production technology thereof

Abstract

The invention discloses a soldering-resistance conductive thin film on the surface of a sensitive structure of a space electrostatic accelerometer. The soldering-resistance conductive thin film comprises a titanium film layer, a platinum film layer and a gold film layer, one side of the titanium film layer is adhered with the surface of a sensitive structure piece of the space electrostatic accelerometer, and the other side surface is sequentially connected with the platinum film layer and the gold film layer. The soldering-resistance conductive thin film completely uses the non-magnetic materials, thus there is no noise interference on measurement of the space electrostatic accelerometer, and all the materials have relatively low coefficient of line-expansion, the relatively good matching between substrate glass material and each film layer can be ensured and stability of the thin film can be ensured.

Description

technical field [0001] The invention relates to the technical field of precision equipment for space science loads, in particular to a solder-resistant conductive film used on the surface of a sensitive structure of a space electrostatic accelerometer, and a manufacturing process thereof. Background technique [0002] Electrostatic accelerometer is a kind of capacitive differential inertial acceleration sensor, which has the characteristics of low measurement frequency, high resolution and large dynamic range. It is especially suitable for measuring quasi-steady state and small acceleration signals. It plays an important role in the fields of control, active vibration reduction, satellite gravity measurement and so on. [0003] The system composition and measurement principle of the electrostatic accelerometer are as follows: figure 1 As shown, the main components include an inertial sensor probe and a detection and control drive circuit. The inertial sensor probe is mainly...

AI Technical Summary

Problems solved by technology

Although this method can avoid the soldering resistance requirements of the film, since the sensor needs to lead out as many as twenty electrode leads, and they are not on the same surface of the same structure, high temperature curing is required after gluing. The lead wire fixing method adds multiple processes, which makes the assembly of the sensor very difficult and reduces the reliability of the sensor

At the same time, in the test stage, the sensor inevitably needs to be disassembled and assembled many times, and the electrode leads are easy to break. Faced with the problem that the electrode leads need to be fixed many times, the original glue needs to be removed before each re-gluing. It is more difficult, and there is a risk of damaging the electrode pads, so the process of using conductive silver glue to fix the electrode leads of the electrostatic accelerometer sensor has many shortcomings

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