Optical fiber output large-power semiconductor laser module

A technology of lasers and semiconductors, applied in semiconductor lasers, the structural details of semiconductor lasers, lasers, etc., can solve problems such as low coupling efficiency, and achieve the effect of improving coupling efficiency and reducing the impact of reliability.

Inactive Publication Date: 2015-12-16
THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the inventors of the present invention have found through research that since the diameter of the output optical fiber is fixed, if the optical fiber is used to directly couple the chip with the increased width of the light-emitting area, the coupling efficiency will be extremely low

Method used

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  • Optical fiber output large-power semiconductor laser module
  • Optical fiber output large-power semiconductor laser module
  • Optical fiber output large-power semiconductor laser module

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Embodiment approach

[0034] As a specific embodiment, the welding bracket 12, the AlN heat sink 13 and the laser chip 14 are fixed by welding with metal solder. As an embodiment, Au80Sn20 (gold-tin alloy) solder is used for welding between the laser chip 14 and the AlN heat sink 13, and PbSn (lead-tin alloy) solder is used for welding between the AlN heat sink 13 and the welding bracket 12, In (indium) solder is used for welding between the welding bracket 12 and the metal tube shell 11, thereby realizing that all components inside the metal tube shell 11 are fixed by metal solder welding, that is, a gel-free welding fixation is realized, thereby The impact of organic volatilization on the reliability of laser chips is reduced. In particular, Au80Sn20 solder is used for welding between the laser chip 14 and the AlN heat sink 13, and Au80Sn20 solder has relatively stable characteristics under high and low temperature cycle conditions, so effective welding between the laser chip 14 and the AlN heat ...

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Abstract

The invention discloses an optical fiber output large-power semiconductor laser module. The optical fiber output large-power semiconductor laser module comprises a semiconductor laser module to be coupled, metalized optical fibers and an optical fiber support. The semiconductor laser module to be coupled comprises a metal tube shell provided with a cavity body, and a welding support, an AlN heat sink and a laser chip which are successively fixed in the cavity body by welding. The metalized optical fibers comprise an output optical fiber and a self-focusing lens optical fiber. The self-focusing lens optical fiber comprises a self-focusing optical fiber and a lens arranged on one end surface of the self-focusing optical fiber, and the other end surface of the self-focusing optical fiber is welded with the output optical fiber. The aperture of the self-focusing lens optical fiber is larger than that of the output optical fiber, and the aperture of the self-focusing lens optical fiber is matched with the width of a luminous zone of the laser chip. The optical fiber support is fixed to the welding support by welding. The self-focusing lens optical fiber is fixed to the optical fiber support by welding. The self-focusing lens optical fiber and the laser chip are coupled and aligned. According to the invention, the aperture of the self-focusing optical fiber is matched with the width of the luminous zone of the laser chip, and all components in the laser module are fixed in a non-glue welding manner.

Description

technical field [0001] The invention belongs to the field of semiconductor lasers, in particular to a fiber output high-power semiconductor laser module. Background technique [0002] High-power semiconductor lasers have the advantages of high photoelectric conversion efficiency, long life, and small size, and are widely used in laser pumping, industrial processing, and military industries. However, due to the large divergence angle of the high-power semiconductor laser beam and the large influence of environmental conditions, it is usually necessary to shape the beam of the semiconductor laser to further couple with the optical fiber and seal it before use. [0003] With the expansion of the application of fiber-coupled output high-power semiconductor lasers, especially in fields with high reliability requirements, such as aviation and aerospace fields, higher requirements are placed on the reliability of devices. For example, in order to obtain high-power coupling optical...

Claims

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Application Information

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IPC IPC(8): H01S5/02H01S5/022
Inventor 郭洪张靖欧翔
Owner THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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