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High-frequency ultrasonic transducer and preparing method thereof

An ultrasonic transducer and high-frequency technology, applied in the ultrasonic field, can solve the problems of low yield, easy damage of piezoelectric sheets, affecting the acoustic performance of ultrasonic probes, etc.

Active Publication Date: 2015-12-23
GREEN VALLEY BRAINTECH SHENZHEN MEDICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the hard and brittle properties of the piezoelectric sheet, the piezoelectric sheet is easily damaged during the preparation of the spherical ultrasonic transducer, resulting in extremely low yield
Because the size of the piezoelectric sheet is small, it is difficult to control the solder joints of the single-sided welding wire to be small, and the solder joints will basically cover the entire emitting surface of the piezoelectric sheet. Due to the impedance mismatch between the piezoelectric material and the solder, The emitted sound waves will lose a lot when passing through the solder joints, which seriously affects the acoustic performance of the ultrasonic probe

Method used

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  • High-frequency ultrasonic transducer and preparing method thereof
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  • High-frequency ultrasonic transducer and preparing method thereof

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Experimental program
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Effect test

Embodiment approach

[0028] like figure 1 , figure 2 As shown, the high-frequency ultrasonic transducer preparation method of the present application, an embodiment thereof, comprises the following steps:

[0029] Step 102: setting the first electrode layer 12 on the upper surface of the piezoelectric sheet 11, and setting the backing layer 13 on the first electrode layer 12, the backing layer 13 is made of conductive material.

[0030] The piezoelectric sheet 11 is made of piezoelectric ceramic material, piezoelectric ceramic composite material, single crystal ferroelectric material or single crystal ferroelectric composite material. Clean the piezoelectric sheet 11 first, and wait for it to dry. Then paste the piezoelectric sheet 11 on a specific platform, and use a fine grinding machine to precisely grind its thickness to t 1 (This thickness is greater than the thickness required for the acoustic performance of piezoelectric ultrasonic transducers).

[0031] Clean the piezoelectric sheet 1...

Embodiment 2

[0057] like image 3 , Figure 4 As shown, the high-frequency ultrasonic transducer of the present application, an embodiment thereof, includes an adapter (not shown), a wire 22, a housing 21 and an ultrasonic transducer assembly, and the ultrasonic transducer assembly is arranged in the housing 21 , the adapter is respectively connected to the positive pole 23 and the negative pole 24 on the ultrasonic transducer assembly through wires 22 . The ultrasonic transducer assembly includes a slit 14, a matching layer 16, a second electrode layer 15, a voltage plate 11, a first electrode layer 12 and a backing layer 13, and the slit 14 filled with a non-conductive polymer, and the matching layer 16. The second electrode layer 15, the voltage sheet 11, the first electrode layer 12 and the backing layer 13 are arranged sequentially from bottom to top, and the slit 14 runs through the upper surface of the backing layer 13 and the lower surface of the piezoelectric sheet 11, and the cu...

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Abstract

The invention discloses a high-frequency ultrasonic transducer and a preparing method thereof. A first electrode layer is arranged on the upper surface of a piezoelectric patch, and a backing layer is arranged on the first electrode layer; the piezoelectric patch is cut from the backing layer to form cutting joints, the cutting joints are filled with nonconductive polymer, and the cutting joints penetrate the piezoelectric patch; a second electrode layer is arranged on the lower surface of the piezoelectric patch; and a matching layer is arranged on the lower surface of the second electrode layer, two of parts cut by the cutting joints are selected, the second electrode layer of at least one of the parts extends to the backing layer from one side face, and a positive electrode and a negative electrode are led out through wires on the backing face respectively. The conductive backing layer is added, the cutting joints divide the conductive backing layer into a certain shape and are filled with the nonconductive polymer, and therefore materials become soft, and damage is not likely to happen in the processing process. A binding electrode manner is adopted, the positive electrode and the negative electrode are arranged on the surface of the backing layer, lead connection is convenient, and meanwhile the added matching layer is not affected.

Description

technical field [0001] The present application relates to the field of ultrasonic technology, in particular to a high-frequency ultrasonic transducer and a preparation method thereof. Background technique [0002] The piezoelectric sheets required for high-frequency spherical self-focusing (or planar) ultrasonic transducers are all thin and have small geometrical dimensions. Due to the hard and brittle properties of the piezoelectric sheet, the piezoelectric sheet is easily damaged in the process of manufacturing the spherical ultrasonic transducer, resulting in an extremely low yield. Because the size of the piezoelectric sheet is very small, it is difficult to control the solder joints of the single-sided welding wire to be small, and the solder joints will basically cover the entire emitting surface of the piezoelectric sheet. Due to the impedance mismatch between the piezoelectric material and the solder, The emitted sound waves will lose a lot when passing through the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/06
Inventor 李永川郭瑞彪钱明郑海荣薛术苏敏
Owner GREEN VALLEY BRAINTECH SHENZHEN MEDICAL TECH CO LTD