A single chip mechanical strength testing device and testing method

Abstract

The invention relates to a single wafer mechanical strength testing device and a testing method. Including test stand, push gauge, spring, also includes sample chuck, bolt. Position the sample bracket on the base of the chuck; put the single wafer into the concave surface on the sample bracket of the sample chuck; adjust the position of the lower beam of the test bench so that the probe of the pressure gauge is in contact with the single wafer; Turn on the push gauge, and make the probe of the push gauge slowly apply force to the single wafer to be tested until the single wafer is crushed; read the maximum pressure value shown by the push gauge, and this pressure value is the mechanical strength of the single wafer under test. Intensity; log data. The effect is that the overall mechanical strength of a single wafer can be accurately tested. According to the size of the single wafer, it is convenient and quick to replace the sample holders of different sizes to accurately and efficiently test the mechanical strength of various materials and single wafers of different sizes to meet the testing requirements of 2-6 inch single wafers. The invention has the advantages of simple structure, easy operation and strong applicability.

Description

technical field [0001] The invention relates to a test device, in particular to a single wafer mechanical strength test device and a detection method. Background technique [0002] In the semiconductor industry, the quality of a single wafer as a substrate directly affects device performance, quality and yield. In recent years, with the increasing emphasis on renewable energy, the photovoltaic industry has maintained a high-speed growth trend, and the monocrystalline silicon solar cell industry has developed by leaps and bounds. In order to reduce the cost of solar cell production, various manufacturers reduce material consumption by continuously reducing the thickness of silicon wafers. However, as the thickness of the silicon wafer decreases, the mechanical strength of the silicon wafer decreases, which eventually leads to a decrease in the yield (Proceedings of the Tenth China Solar Photovoltaic Conference in 2008, pp. 283-286). Therefore, the mechanical strength of sil...

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Problems solved by technology

However, this method is used to test the mechanical strength of a single wafer. It can only test the local mechanical strength of a single wafer, and it is difficult to characterize the overall mechanical strength of a single wafer.

The traditional single chip mechanical strength test method can only test a single chip of a fixed size due to the fixed mechanical structure of the single chip bracket used. If you need to test a single chip of other sizes, you need to replace the entire single chip bracket, which is inconvenient to use

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