Mechanical strength test device for monocrystal chip and detection method

Abstract

The invention relates to a mechanical strength test device for a monocrystal chip and a detection method. The mechanical strength test device comprises a testing bench, a push pressure gauge and a spring and further comprises a sample chuck and bolts. A sample bracket is located on a chuck base; the monocrystal chip is placed in the sample chuck, and the sample bracket is provided with a circle of concave surface; the position of a lower crossbeam of the testing bench is adjusted so as to enable a probe of the push pressure gauge to be in contact with the monocrystal chip; the push pressure gauge is turned on, and the probe of the push pressure gauge is enabled to slowly apply a force to the monocrystal chip to be tested until the monocrystal chip is crushed; the maximum pressure value shown by the push pressure gauge is read and is the mechanical strength of the tested monocrystal chip; and data are recorded. The mechanical strength test device and the detection method have the effects that the global mechanical strength of the monocrystal chip can be tested accurately. Sample brackets of different sizes can be conveniently and rapidly replaced according to sizes of monocrystal chips so as to accurately and efficiently test the mechanical strength of the monocrystal chips of a variety of materials and different sizes, and thus, the requirements of 2-6-inch monocrystal chips on test are met. The mechanical strength test device is simple in structure, easy to operate and high in applicability.

Description

technical field [0001] The invention relates to a test device, in particular to a single wafer mechanical strength test device and a detection method. Background technique [0002] In the semiconductor industry, the quality of a single wafer as a substrate directly affects device performance, quality and yield. In recent years, with the increasing emphasis on renewable energy, the photovoltaic industry has maintained a high-speed growth trend, and the monocrystalline silicon solar cell industry has developed by leaps and bounds. In order to reduce the cost of solar cell production, various manufacturers reduce material consumption by continuously reducing the thickness of silicon wafers. However, as the thickness of the silicon wafer becomes thinner, the mechanical strength of the silicon wafer decreases, which eventually leads to a decrease in the yield (Proceedings of the Tenth China Solar Photovoltaic Conference in 2008, reported on pages 283-286). Therefore, the mechan...

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Problems solved by technology

However, this method is used to test the mechanical strength of a single wafer. It can only test the local mechanical strength of a single wafer, and it is difficult to characterize the overall mechanical strength of a single wafer.

The traditional single chip mechanical strength test method can only test a single chip of a fixed size due to the fixed mechanical structure of the single chip bracket used. If you need to test a single chip of other sizes, you need to replace the entire single chip bracket, which is inconvenient to use

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