Hybrid wavelength laser wire-stripping method and wire-stripping apparatus of wire sheaths

A technology of mixing wavelengths and wire sheaths, applied in the field of wire stripping devices, can solve the problems of high cost, low efficiency, unfavorable flow operation, etc., and achieve the effects of convenient operation, improved efficiency and good wire stripping effect.

Inactive Publication Date: 2015-12-23
SUZHOU UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] During laser wire stripping, it is necessary to select the appropriate laser wavelength for different materials, so as to achieve efficient and high-quality wire stripping. However, when the existing processing stripping technology strips multi-layered wires, it is often necessary to use a CO2 laser to strip the wires first. The outer insulation, and then replace the YAG laser to peel off the inner metal braid, which has low efficiency, high cost, and is not conducive to streamlined operations

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  • Hybrid wavelength laser wire-stripping method and wire-stripping apparatus of wire sheaths
  • Hybrid wavelength laser wire-stripping method and wire-stripping apparatus of wire sheaths
  • Hybrid wavelength laser wire-stripping method and wire-stripping apparatus of wire sheaths

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Embodiment Construction

[0043] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0044] see figure 1 As shown, the wire 100 to be stripped includes a metal core 101 , a metal braid 102 wrapped around the metal core 101 from inside to outside, and an insulating outer layer 103 .

[0045] see figure 2 As shown, the mixed-wavelength laser stripping device for the wire sheath includes:

[0046] Light source 1: The light source includes two groups of laser diodes, which are respectively a plurality of first laser diodes 11 that can generate a wavelength of λ1 and are correspondingly used for cutting the insulating outer layer 103, and a plurality of first laser diodes 11 that can generate a wavelength of λ2 and are correspondingly used for cutting The second laser diode 12 of the metal braided layer 102 arranges all the first laser diodes 11 and the second laser diodes 12 at intervals in turn to for...

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Abstract

The invention discloses a hybrid wavelength laser wire-stripping method and wire-stripping apparatus of wire sheaths. A light source can emit laser beams with different wavelengths which are respectively correspondingly used for cutting and stripping the different wire sheaths, then after collimation, clustering and shaping processing are successively performed on the laser beams, the laser beams are divided into multiple cutting light beams by use of a splitting apparatus, and 360-degree blind-angle-free cutting stripping is performed on the wire sheaths. According to the invention, the wire stripping effect is good, the operation is also very convenient, and the efficiency is substantially improved.

Description

technical field [0001] The invention relates to a mixed-wavelength laser wire stripping method and a wire stripping device for a wire sheath. Background technique [0002] When stripping the sheath of the wire, two stripping methods, traditional mechanical stripping and laser stripping, are mainly used. Mechanical stripping can realize the integration of wire sheath cutting and extraction, but because the jaws of the tool used contact the wire, it will generate a certain amount of extrusion and cutting force on the metal core on the wire, resulting in damage to the metal core. If the jaws are not in contact with the metal wire, the insulation cannot be stripped and cut cleanly. For the side insulation conductor composed of multiple layers of rayon fabric, mechanical stripping is even more difficult to meet the requirements. Laser stripping does not produce any mechanical extrusion and mechanical stress on the processed materials, especially does not damage the metal core ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G1/12B23K26/38B23K26/067B23K26/064
CPCH02G1/128
Inventor 王明娣杨桂林杜秋孙立宁
Owner SUZHOU UNIV
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