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Thermal type pressure sensor

A pressure sensor and heater technology, which is applied in elastic deformation gauge-type fluid pressure measurement, instrument, and measurement force, etc., can solve the problems of pressure sensor performance, pressure sensor error, and low test pressure accuracy, and achieve high sensitivity, The effect of high precision and low production cost

Active Publication Date: 2015-12-30
美新半导体(天津)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a pressure sensor with a traditional structure, the pressure sensor chip is directly fixed on the substrate. During the assembly and use of the pressure sensor, the stress on the substrate will be transmitted to the pressure sensor chip. Pressure Sensor Performance Issues
[0003] Existing pressure sensors not only have high cost and low integration, but also have low test pressure accuracy

Method used

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Embodiment Construction

[0027] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0028] Reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure or characteristic that can be included in at least one implementation of the present invention. "In one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

[0029] see Figure 1-3 . figure 1 is a schematic structural view of the thermal pressure sensor of the present invention when it is not under pressure; figure 2 yes figure 1 Schematic diagram of the top view structure; image 3 It is a schematic cross-sectional view of the thermal pressure sensor of the present invention when it is under pressure. Such as Figure 1-3 As shown, the thermal pressure sensor includes a substrate 100, which is formed ...

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Abstract

The invention provides a thermal type pressure sensor which comprises a baseplate, wherein a groove is formed in the baseplate, a thin film is arranged at the opening part of the groove; the groove is closed into a cavity through the thin film; thermocouples ad heaters are arranged in the cavity; the thermocouples are respectively positioned on the inner sides and the outer sides of the heaters. Compared with the prior art, the manufacture cost is low, the integrated level is high, the size is small, the space is saved, the sensitivity is high, and the precision of measured pressure is high.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a thermal MEMS pressure sensor. Background technique [0002] With the development of miniaturization and miniaturization of electronic products, the requirements of electronic products for the miniaturization of their internal components are getting higher and higher. As a common sensor, the pressure sensor is used in various electronic products, so the miniaturization design of the pressure sensor has also become a focus of attention. In order to ensure the miniaturization design of pressure sensors, pressure sensors based on Micro-Electro-Mechanical Systems (Micro-Electro-MechanicalSystem, MEMS) have attracted more and more attention. A pressure sensor based on MEMS technology includes a substrate fixed to a casing of the substrate, and the substrate and the casing constitute an external packaging structure of the pressure sensor. A pressure sensor chip and an integrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L7/08G01L1/00
Inventor 凌方舟蒋乐跃
Owner 美新半导体(天津)有限公司