High-heat-conduction metal substrate resin glue filling method, vacuum press fit structure and metal substrate

Abstract

The invention discloses a high-heat-conduction metal substrate resin glue filing method, a vacuum press fit structure and a metal substrate, used for improving the production quality of a high-heat-conduction metal substrate. The method comprises the steps of cutting the high-heat-conduction metal substrate; drilling plugging resin holes in the high-heat-conduction metal substrate, hotly attaching high-heat-conduction films to the double surfaces of the high-heat-conduction metal substrate, and carrying out rolling attaching; cutting epoxy resin prepreg with the size same as that of the high-heat-conduction metal substrate; sequentially arranging kraft paper, a mirror surface steel plate, a release film, the high-heat-conduction metal substrate drilled with the plugging resin holes, the epoxy resin prepreg, a copper foil, a release film, a mirror surface steel plate and kraft paper on a bearing disc of a vacuum press from bottom to top in sequence; and after being covered by a cover plate, feeding the bearing disc to the vacuum press to be subjected to vacuum press fit, thus obtaining the high-heat-conduction metal substrate filled with resin.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a resin filling method for a metal substrate with high thermal conductivity, a vacuum pressing structure and a metal substrate. Background technique [0002] In existing circuit board manufacturing methods, resin filling is a manufacturing process that is often used in the manufacture of high thermal conductivity metal substrates to meet product requirements or process capability requirements. The high thermal conductivity metal substrate is filled with resin after the high thermal conductivity metal substrate is drilled, and then drilled to make the circuit. The requirements for the filling process and the quality of the glue filling are higher. At present, the resin filling commonly used in the industry is mainly used for the filling of semi-finished epoxy resin circuit boards, and is used to protect the exposed copper layer on the hole wall. Th...

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Problems solved by technology

[0003] However, in the existing method, the resin filling is prone to quality defects such as bubbles in the resin in the hole, unfilled resin depression, resin cracking, separation of the resin and the hole wall, etc.

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