Rapid cooling furnace body of a horizontal diffusion furnace

Abstract

The invention discloses a fast cooling furnace body of a horizontal diffusion furnace. The fast cooling furnace body comprises a reaction quartz tube and a resistance furnace body arranged outside the reaction quartz tube in a sleeving manner. A columnar clearance with an annular cross section is arranged between the outer wall of the reaction quartz tube and the inner wall of the resistance furnace body. Sealing pieces are arranged at the two ends of the columnar clearance so that a closed ventilation channel can be formed by the columnar clearance. The resistance furnace body is provided with an air inlet for supplying air to the ventilation channel and air outlets for exhausting hot air in the ventilation channel. The fast cooling furnace body has the beneficial effects that the fast cooling function is achieved, and the influence of temperature fluctuation on a semiconductor part is reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor electronic components, in particular to a fast-cooling furnace body of a horizontal diffusion furnace. Background technique [0002] There are many heat treatment processes in the manufacturing process of semiconductor devices, such as thermal oxidation, chemical vapor deposition (CVD), thermal diffusion, metal alloying, impurity activation, and dielectric film densification. These heat treatment processes are very sensitive to temperature, especially the control of rapid cooling ability is very important. In the conventional cooling method, the wafer is usually placed in the wafer boat of the furnace body, and the wafer is cooled by the natural cooling of the furnace body, but the existing problem is that the natural cooling rate is slow, resulting in long process time and poor film quality. Easy to guarantee. This treatment method will increase the diffusion of harmful impu...

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Problems solved by technology

In the conventional cooling method, the wafer is usually placed in the wafer boat of the furnace body, and the wafer is cooled by the natural cooling of the furnace body, but the existing problem is that the natural cooling rate is slow, resulting in long process time and poor film quality. easy to guarantee

The traditional water cooling method for rapid cooling has problems such as large heat dissipation and high power consumption; while the traditional air cooling method will be affected by the external environment, resulting in temperature fluctuations and poor repeatability of the furnace temperature

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