Heat dissipation and cooling system of computer

A cooling and computer technology, applied in computing, instruments, electrical and digital data processing, etc., can solve problems such as abnormality, burnt parts, dust influx, etc., to achieve good heat dissipation and cooling effect, keep the air clean, and improve reliability. Effect

Inactive Publication Date: 2016-01-06
TONGFANG COMP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

The main defect of this heat dissipation method is that strong noise, vibration, dust influx and large power are required during the heat dissipation and cooling process.
Noise can make people unhappy, and vibration can adversely affect the CPU and graphics card, causing the DIE to be gradually worn out, causing poor contact between the CPU and the CPU socket, and the graphics card and the AGP slot
A large i

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  • Heat dissipation and cooling system of computer

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[0014] The present invention will be further described below in conjunction with specific embodiments.

[0015] Such as figure 1 As shown, the computer heat dissipation and cooling system of the present invention includes a chassis. An air inlet 1 is provided at the lower part of the side plate of the chassis away from the main board. The air inlet 1 is connected to the air duct 2, and the air supply device 3 is arranged in the air duct 2. On the outside of the air inlet 1 is provided a support 9 for placing the refrigerant, an air outlet 4 is provided on the upper part of the side panel of the chassis, and an air exhaust device 5 is provided on the air outlet; the air duct is L-shaped, which is divided into a horizontal end and a vertical end The vertical end of the air duct is parallel to the side plate, a number of air outlet holes 6 are arranged on the vertical end, and the top of the vertical end is closed. When the system is working, the air supply device sucks the outside...

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Abstract

The invention relates to a heat dissipation and cooling system of a computer. The heat dissipation and cooling system comprises a case, wherein the lower part, which is far away from a mainboard, of a side board of the case, is provided with an air inlet; the air inlet is connected with an air duct arranged in the case; an air supply device is arranged in the air duct; the outer part of the air inlet is provided with a bracket where refrigerant is put; the upper part of the side board of the case is provided with an air outlet; the air outlet is provided with an air draft device; the air duct is of an L shape and is divided into a horizontal end and a vertical end; the vertical end of the air duct is in parallel with the side board; the vertical end is provided with a plurality of air discharge holes; and the top end of the vertical end is sealed. The heat dissipation and cooling system of the computer is provided with the air supply device and the refrigerant to forcedly convey low-temperature air to the case of the computer, so that the heat dissipation and cooling system has the advantages of good cooling effect and high efficiency on an aspect of heat dissipation and cooling, dust can be prevented from entering the case since the air inlet and the air outlet are both provided with air filter screens, and therefore, air in the case is kept clean.

Description

technical field [0001] The invention relates to the technical field of personal desktop computers, in particular to a computer cooling system. Background technique [0002] With the advancement of science and technology, computers equipped with high-frequency CPUs and graphics cards exceeding 1GHz have become the mainstream of the market, followed by hardware heat dissipation has become a top priority. If the heat dissipation is not enough, it will cause computer failures or even Crash, burn. [0003] The most effective and convenient method that personal microcomputer heat dissipation adopts is exactly to use fan and heat sink at present. The heat sink is closely attached to the chip on the CPU or graphics card. The heat generated by the chip on the CPU or graphics card is transferred to the heat sink through heat conduction, and the flowing air generated by the fan quickly blows the heat on the heat sink to the nearby air. , The cooling effect is directly related to the ...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 马江伟李新辉刘全洲游文
Owner TONGFANG COMP
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