Heat dissipation and cooling system of computer

Abstract

The invention relates to a heat dissipation and cooling system of a computer. The heat dissipation and cooling system comprises a case, wherein the lower part, which is far away from a mainboard, of a side board of the case, is provided with an air inlet; the air inlet is connected with an air duct arranged in the case; an air supply device is arranged in the air duct; the outer part of the air inlet is provided with a bracket where refrigerant is put; the upper part of the side board of the case is provided with an air outlet; the air outlet is provided with an air draft device; the air duct is of an L shape and is divided into a horizontal end and a vertical end; the vertical end of the air duct is in parallel with the side board; the vertical end is provided with a plurality of air discharge holes; and the top end of the vertical end is sealed. The heat dissipation and cooling system of the computer is provided with the air supply device and the refrigerant to forcedly convey low-temperature air to the case of the computer, so that the heat dissipation and cooling system has the advantages of good cooling effect and high efficiency on an aspect of heat dissipation and cooling, dust can be prevented from entering the case since the air inlet and the air outlet are both provided with air filter screens, and therefore, air in the case is kept clean.

Description

technical field [0001] The invention relates to the technical field of personal desktop computers, in particular to a computer cooling system. Background technique [0002] With the advancement of science and technology, computers equipped with high-frequency CPUs and graphics cards exceeding 1GHz have become the mainstream of the market, followed by hardware heat dissipation has become a top priority. If the heat dissipation is not enough, it will cause computer failures or even Crash, burn. [0003] The most effective and convenient method that personal microcomputer heat dissipation adopts is exactly to use fan and heat sink at present. The heat sink is closely attached to the chip on the CPU or graphics card. The heat generated by the chip on the CPU or graphics card is transferred to the heat sink through heat conduction, and the flowing air generated by the fan quickly blows the heat on the heat sink to the nearby air. , The cooling effect is directly related to the ...

AI Technical Summary

Problems solved by technology

The main defect of this heat dissipation method is that strong noise, vibration, dust influx and large power are required during the heat dissipation and cooling process.

Noise can make people unhappy, and vibration can adversely affect the CPU and graphics card, causing the DIE to be gradually worn out, causing poor contact between the CPU and the CPU socket, and the graphics card and the AGP slot

A large influx of dust will lead to faster wear of moving parts. The dust accumulated on the surface of computer components can easily cause a short circuit and burn the components. The dust accumulated on the fan blades is the main factor that produces vibration and noise.

When too much dust accumulates on the heat sink, it will greatly affect the heat dissipation effect and may cause abnormalities or even failures

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