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Connecting technology for metals without solid solubility

A non-solid solution, metal technology, used in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of cumbersome process, uneven and discontinuous bonding interface, etc.

Inactive Publication Date: 2016-01-13
MICCOOL YUEMEI TIANJIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the inventors found in the process of realizing the present invention that the existing method of directly connecting two metals that are not solid-dissolvable has problems such as relatively cumbersome process and uneven and discontinuous bonding interface between the two metals.

Method used

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  • Connecting technology for metals without solid solubility
  • Connecting technology for metals without solid solubility
  • Connecting technology for metals without solid solubility

Examples

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Embodiment 1

[0021] Embodiment 1. The joining process of mutually insoluble metals. The procedure of this method is as follows figure 1 shown.

[0022] figure 1 , S100. Perform pretreatment on the first metal and the second metal to be connected.

[0023] Specifically, the first metal in this embodiment may be molybdenum, the first metal may also be tungsten, the second metal may be copper, and the second metal may also be silver. That is to say, the technical solution of this embodiment can connect molybdenum and copper, molybdenum and silver, tungsten and copper, or tungsten and silver.

[0024] The first metal in this embodiment can be in the shape of a plate, or in the shape of an elongated rod (such as a round rod or a square rod, etc.) or block, and the second metal can be in the shape of a plate, or in an elongated shape. Rods (such as round rods or square rods, etc.) or blocks.

[0025] It should be noted that the specific shapes of the interconnected first metal and the secon...

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Abstract

The invention relates to a connecting technology for metals without solid solubility. The technology includes the steps that the first metal and the second metal to be connected are pretreated; powder of the second metal is pressed into a blank with the thickness of 2-5 mm; the first metal, the blank and the second metal are sequentially stacked; the first metal, the blank and the second metal which are sequentially stacked are fixed and pressed so that the first metal and the second metal can be tightly attached to the blank; and the first metal, the blank and the second metal which are fixed and pressed are subjected to annealing treatment, wherein the first metal is molybdenum or tungsten, the second metal is copper or silver, and the annealing temperature of the annealing treatment is 10-50 DEG C lower than the melting point of the second metal. According to the technical scheme, the technology is simple, and a uniform and continuous bonding interface and high bonding strength between the metals without solid solubility can be achieved.

Description

technical field [0001] The invention relates to a connection technology between metals, in particular to a connection technology of mutually insoluble metals. Background technique [0002] In some technical fields, especially in nuclear fusion and other technical fields, there is often a need to connect two metals that are not solid solution to each other; a specific example, molybdenum has a high melting point and good thermal conductivity. Because of the characteristics of high efficiency, low vapor pressure and low sputtering, it becomes an excellent plasma facing material, while copper is an excellent heat sink material due to its good thermal conductivity. Since nuclear fusion technology requires plasma facing materials To connect with the heat sink material, therefore, the mutually insoluble metals molybdenum and copper need to be connected together. The mutually insoluble metals here mean that the solid solubility between metals is small, or even zero. [0003] At p...

Claims

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Application Information

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IPC IPC(8): B23K20/02B23K20/16B23K20/233C21D1/26
CPCB23K20/026B23K20/16B23K20/233B23K2103/18C21D1/26
Inventor 郭江
Owner MICCOOL YUEMEI TIANJIN TECH CO LTD
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