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Water spray device for silicon wafer cutting machine

A water spray device and cutting machine technology, applied in the fields of filtration and separation, work accessories, chemical instruments and methods, etc., can solve the problems of short service life of water spray pipes and inability to filter liquids, etc., to extend service life, optimize quality, improve The effect of production efficiency

Inactive Publication Date: 2017-01-04
ZHEJIANG HUIHONG SOLAR ENERGY CO LTD
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0004] The present invention provides a water spray device for a silicon wafer cutting machine, which aims to overcome the shortcomings of the water spray device used in the silicon wafer cutting machine in the prior art that cannot filter liquid and the service life of the water spray pipe is short

Method used

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  • Water spray device for silicon wafer cutting machine
  • Water spray device for silicon wafer cutting machine
  • Water spray device for silicon wafer cutting machine

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Embodiment Construction

[0018] A water spray device for a silicon wafer cutting machine of the present invention will be further described below in conjunction with the accompanying drawings. Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, a water spray device for a silicon wafer cutting machine includes a drainage frame 1 fixed on the cutting machine, and a water spray pipe 2 with openings at both ends is fixed on the drainage frame 1 through a fixing seat 8, and the water spray pipe 2. One end is provided with a water supply interface 3, and the water supply interface 3 is connected with the water supply system of the cutting machine so as to realize the water supply system supplying water to the water spray pipe 2. The other end of the water spray pipe 2 is provided with a closed water spray pipe 2 The plug 4, the water spray pipe 2 is provided with at least one liquid discharge port 5, the liquid discharge port 5 communicates with the inner cavity of the water spray pipe 2, and t...

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Abstract

The invention relates to a water spraying device for a silicon wafer cutting machine. By the adoption of the water spraying device for the silicon wafer cutting machine, the technical problems that in the prior art, a water spraying device cannot be used for filtering liquid, and the service life of a water spraying pipe is short are solved. According to the water spraying device for the silicon wafer cutting machine, a liquid outlet is formed in a water spraying pipe, so that the liquid outlet is not prone to blockage, impurities blocking the liquid outlet can be removed quite easily even if the liquid outlet is blocked, and thus the service life of the water spraying pipe is prolonged; in addition, the water spraying pipe is filled with a filter body, a filter screen used for filtering liquid discharged from the liquid outlet is fixed to a drainage frame, the liquid can be filtered while water is supplied through the water spraying pipe, in this way, the quality of the liquid is optimized, and the production efficiency of silicon wafers is improved.

Description

technical field [0001] The invention relates to a silicon chip cutting machine accessory, in particular to a water spray device for a silicon chip cutting machine. Background technique [0002] The production of silicon wafers used to be cut by steel wire-loaded mortar before, but now it is directly cut by a special gold-steel wire with water. This technology not only greatly shortens the production and processing time, but also improves the overall quality of the product. Production costs have also dropped significantly. The diamond wire cutting technology also has high requirements for water quality, not only requires pure water and additives, but also requires no solid small particles in the water. If there is a lot of solid debris in the water, the wire mesh will easily bring the debris to the main roller during cutting, which will cause skipping and lead to a high probability of wire breakage, and the solid debris will adhere to the seam of the silicon rod so that the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/02B01D35/02
Inventor 陈小力张国华
Owner ZHEJIANG HUIHONG SOLAR ENERGY CO LTD
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