Detection method of FPC (flexible printed circuit) high-Tg glued substrate

A detection method and technology of gum base, which can be used in measuring devices, analytical materials, instruments, etc., and can solve problems such as deformation

Inactive Publication Date: 2016-01-20
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Ordinary FPC substrates may cause quality problems suc

Method used

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Example Embodiment

[0016] The present invention will be further described below in conjunction with specific embodiments:

[0017] The method for detecting FPC high Tg adhesive substrates of the present invention mainly includes the following steps:

[0018] (1) Carry out aging test on FPC high Tg rubber substrate.

[0019] The test conditions of the aging test: the aging temperature is 120℃, and the aging time is 2h. The first aging is the pretreatment of thermal shock, constant temperature and humidity, and high temperature storage test.

[0020] (2) Carry out thermal shock test, constant temperature and humidity on FPC high Tg plastic substrate. Test, high temperature storage test.

[0021] Test conditions for thermal shock test: low temperature impact temperature is -42~-38℃, low temperature impact time is 30min; high temperature impact temperature is 123~127℃, high temperature impact time is 30min; the number of impacts is 500 times for high and low temperature, low temperature The transition time...

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Abstract

The invention relates to the field of substrate detection, in particular to a detection method of an FPC (flexible printed circuit) high-Tg glued substrate applied to vehicle-mounted LED (light emitting diode) lamp products. The method mainly comprises the following steps of (1) performing aging test on the FPC high-Tg glued substrate; (2) respectively performing a cold and hot impact test, a constant-temperature and constant-humidity test and a high-temperature storage test on the FPC high-Tg glued substrate. The method provided by the invention can be used for detecting whether the FPC high-Tg glued substrate has the heat-resistant performance and the environment-resistant performance or not and whether the dimension stability and the mechanical intensity can be maintained at high temperature or not, so that whether the electric performance of the substrate is reduced or not and whether the service life of a product can be influenced or not are determined, and the quality of the substrate is further determined.

Description

technical field [0001] The invention relates to the field of base material detection, in particular to a detection method for FPC high Tg adhesive base materials used in automotive LED lamp products. Background technique [0002] The flexible circuit board FPC has the advantages of small size, light weight, 3D three-dimensional rotation and dynamic winding. Its powerful advantages not only enable it to be used in traditional fields such as consumer electronics, but also in automotive high-end value-added fields such as smartphone terminals, automotive LED lights, automotive dashboards, and automotive engines. [0003] At present, the application of FPC has been developing in a diversified direction, and the application in the traditional field has become saturated, while the research on the vehicle field is in a period of rapid development. Vehicle-mounted FPC is different from traditional FPC, and its material, process, quality and performance requirements are different. ...

Claims

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Application Information

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IPC IPC(8): G01N3/60G01N17/00
Inventor 胡珂珂郑泽红
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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