Analytical method for double convection cooling performance of rectangular heat sink with eccentric heat source

Abstract

The present invention relates to an analytical method for the double convective heat dissipation performance of a rectangular heat sink with an eccentric heat source. By dividing the heat source area into a uniform grid, combined with the heat loss matrix and the non-uniform heat power matrix in the heat source area, iteratively calculates the excess temperature of all nodes in the heat source area. Iteration value, use the difference between the average value of the excess temperature iteration result and the average value of the previous iteration result to judge the convergence of the iteration result, count the local maximum value of the excess temperature in the heat source area, divide the grid on the upper and lower surfaces of the area without the heat source, and calculate the nodes Excess temperature and average value, to obtain the total power of convection heat dissipation on the upper and lower surfaces of the heat source area, according to the local maximum value of excess temperature in the heat source area, the average value of excess temperature on the upper and lower surfaces of the heat source area and the total power of convection heat dissipation, two-dimensional heat source The uniform heating power is used to obtain the maximum diffusion thermal resistance corresponding to the heat dissipation from the heat source to the upper and lower surfaces of the heat sink, and the maximum total thermal resistance between the heat source and the environment. The present invention can intuitively describe the heat dissipation problem and obtain more comprehensive data.

Description

technical field [0001] The invention belongs to the technical field of encapsulation and heat dissipation of electronic devices, and in particular relates to a method for analyzing the heat dissipation performance of a rectangular heat dissipation plate in which a heat source of a device is eccentrically packaged on the upper surface of a rectangular heat dissipation plate and both upper and lower surfaces are in a convective cooling state. Background technique [0002] While electronic devices are developing according to the trend of miniaturization, their electronic functions are also improving day by day. The higher and higher chip integration level leads to the increase of power consumption per unit area and the gradual increase of chip junction temperature. In order to avoid shortening the service life and reliability of the device due to excessive junction temperature, packaging the device on the surface of the finned heat sink is the most common heat dissipation method...

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Problems solved by technology

However, due to the use of the equivalent thermal path analysis method, the above method can only calculate the average temperature of the heat source and the average thermal diffusion resistance value, and cannot accurately obtain the temperature value on any specified coordinates, so there is still the possibility of underestimating the local maximum temperature

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