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A pipe cooling module

A technology of heat dissipation module and heat dissipation module, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc.

Active Publication Date: 2018-01-12
速维工程技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the internal structure of the fan and the design of the fluid resistance have become the bottleneck of its development.

Method used

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  • A pipe cooling module
  • A pipe cooling module

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Comparison scheme
Effect test

Embodiment 1

[0021] A pipe heat dissipation module, the pipe heat dissipation module includes a pipe and at least one heat dissipation module, the pipe is provided with a slot, the heat dissipation module includes a heat absorber, a heat sink, and a heat pipe connecting the two, and the heat sink is composed of 20 T-shaped single The heat sink is arranged inside the pipe through slots, and 5 of the T-shaped single pieces are provided with heat pipe grooves for connecting the heat sink and the heat pipe. The cooling module also includes a sealing cover, which is used to close the slot, and the sealing cover is provided with two grooves for passing the heat pipe, and has two corresponding heat pipe sealing blocks for sealing. There are 3 T-shaped monolithic T-tops in the T-shaped monolith to withstand the sealing cover. The heat pipe groove can also be arranged in the middle part of the T-shaped monolithic sheet.

[0022] The cooling fins are distributed in a "T" shape, and the number and s...

Embodiment 2

[0024] A pipe heat dissipation module, the pipe heat dissipation module includes a pipe and at least one heat dissipation module, the pipe is provided with a slot, the heat dissipation module includes a heat absorber, a heat sink, and a heat pipe connecting the two, and the heat sink is composed of 16 T-shaped single The heat sink is arranged inside the pipe through slots, and three of the T-shaped single plates are provided with heat pipe grooves for connecting the heat sink and the heat pipe. The cooling module also includes a sealing cover, which is used to close the slot, and the sealing cover is provided with two grooves for passing the heat pipe, and has two corresponding heat pipe sealing blocks for sealing. There are 5 T-shaped monolithic T-tops in the T-shaped monolith to withstand the sealing cover. The heat pipe groove can also be arranged in the middle part of the T-shaped monolithic sheet.

Embodiment 3

[0026] A pipe heat dissipation module, the pipe heat dissipation module includes a pipe and at least one heat dissipation module, the pipe is provided with a slot, the heat dissipation module includes a heat absorber, a heat sink, and a heat pipe connecting the two, and the heat sink is composed of 25 T-shaped single The heat sink is arranged inside the pipe through slots, and two of the T-shaped single pieces are provided with heat pipe grooves for connecting the heat sink and the heat pipe. The cooling module also includes a sealing cover, which is used to close the slot, and the sealing cover is provided with two grooves for passing the heat pipe, and has two corresponding heat pipe sealing blocks for sealing. There are 5 T-shaped monolithic T-tops in the T-shaped monolith to withstand the sealing cover. The heat pipe groove can also be arranged in the middle part of the T-shaped monolithic sheet.

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PUM

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Abstract

The invention discloses a pipeline heat dissipation module. The pipeline heat dissipation module includes a pipeline and at least one heat dissipation module. The pipeline is provided with a slot. The heat pipe, the heat sink is composed of a plurality of T-shaped single pieces, the heat sink is arranged inside the pipe through slots, and at least two of the multiple T-shaped single pieces are provided with heat pipe grooves , used to connect the heat sink and heat pipe. The heat sink is installed in the pipe, and the single heat sink is distributed in a "T" shape. The gas-liquid fluid flows from the pipe and flows between the heat sinks to take away the heat. Fluid power devices such as fans or liquid pumps are installed outside the working space of the heating element, which saves space, avoids the influence of ambient temperature, and effectively protects the thermal interference of other electronic or mechanical components. It can be applied to high-end large-scale electronic equipment, mechanical power equipment, and chemical reactors , power equipment and other cooling systems.

Description

technical field [0001] The invention relates to the field of heat dissipation, and more specifically, to a pipe heat dissipation module. Background technique [0002] The heat dissipation method refers to the main way the radiator dissipates heat. In thermodynamics, heat dissipation is heat transfer, and there are three main ways of heat transfer: heat conduction, heat convection and heat radiation. The transfer of energy by itself or when matter comes into contact with matter is known as heat conduction, and it is the most common form of heat transfer. For example, the way that the heat sink base is in direct contact with the heat source to take away heat is heat conduction. Heat convection refers to the heat transfer method in which flowing fluid (gas or liquid) takes heat away. In the heat dissipation system of the chassis, the "forced heat convection" heat dissipation method in which the cooling fan drives the gas flow is more common. Thermal radiation refers to the t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36H05K7/20
Inventor 姜文新邓中应谭弘平
Owner 速维工程技术股份有限公司