Chip heat radiation assembly and chip circuit board thereof

A chip heat dissipation and circuit board technology, applied in the field of communications, can solve the problems of radiator falling off, production efficiency reduction, falling off, etc., to avoid chip being crushed, improve assembly efficiency, and improve reliability.

Inactive Publication Date: 2016-01-27
GUANGXUN SCI & TECH WUHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the usual method is to add a heat sink on the chip, and then use a thermal interface material with bonding function (such as pressure-sensitive double-sided adhesive, two-component thermally conductive adhesive) to fix the heat sink on the chip, but the above-mentioned adhesive The bonding force of the thermal interface material with bonding function can only reach the effective value after bonding for a period of time, and in the bonding process, due to the weight of the heat sink itself, it will c

Method used

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  • Chip heat radiation assembly and chip circuit board thereof
  • Chip heat radiation assembly and chip circuit board thereof
  • Chip heat radiation assembly and chip circuit board thereof

Examples

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[0046] The specific implementation of the present invention will be described below in conjunction with the drawings.

[0047] The invention provides a chip heat dissipation component, such as figure 1 , Figure 4 , Figure 3a , Figure 3b As shown, applied to the heat dissipation of the chip 7 on the circuit board, the chip heat dissipation assembly includes: a base 1, a plurality of heat dissipation fins 2, a plurality of springs 3, a plurality of adjusting rod assemblies 4, a plurality of locking screws 5, and a plurality of fastening screws Screw 8 ( figure 1 versus Figure 4 The number of springs, adjusting rod components, locking screws, and fastening screws are shown in 4); the base 1 includes an upper surface 104 and a lower surface 105, and the heat dissipation fins 2 are installed on the upper surface 104 Above, the lower surface 105 is provided with a base boss 103, the height of the base boss 103 is H2, the upper surface of the base 104 is provided with a number of cir...

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Abstract

The invention discloses a chip heat radiation assembly and a chip circuit board thereof. The heat radiation assembly comprises a base (1), heat radiation fins (2), springs (3), adjusting rod assemblies (4) and locking screws (5). The upper surface (104) of the base (1) is provided with circular holes (102) and special-shaped through holes (101), wherein the depths of the circular holes (102) are smaller than the thickness of the base (1). The lower surface (105) of the base is provided with a base boss (103) for installing a chip. Each adjusting rod assembly (4) comprises a support bar (401) and an adjusting nut (403), the support bar (401) is composed of a polished rod (406) and a threaded rod (402), the adjusting nut (403) is internally provided with a threaded through hole (405), and the threaded rod (402) is provided with external threads screwed with an inner threaded hole (404). The height of each adjusting nut (403) is smaller than the sum of heights of the chip and the base boss (103), and the locking screws (5) are screwed into the threaded through holes (405). The invention can improve the heat radiation effect and the assembly reliability.

Description

technical field [0001] The invention relates to the technical field of communication, and relates to a heat dissipation component and a circuit board using the heat dissipation component, in particular to a chip heat dissipation component and a chip circuit board thereof. Background technique [0002] With the continuous development of the electronic information industry, the operating frequency and speed of the chip are constantly increasing, and the heat generated by it is increasing, which makes its temperature rise continuously, which seriously threatens the performance of the chip when it is running. In order to ensure the normal operation of the chip, it must be timely Dissipate the large amount of heat generated by the chip. At present, the usual method is to add a heat sink on the chip, and then use a thermal interface material with bonding function (such as pressure-sensitive double-sided adhesive, two-component thermally conductive adhesive) to fix the heat sink on...

Claims

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Application Information

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IPC IPC(8): H01L23/40H01L23/367
Inventor 杨明冬王文忠杨宇翔江毅全本庆
Owner GUANGXUN SCI & TECH WUHAN
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