A kind of release method of flexible display device
A flexible display and release technology, applied in chemical instruments and methods, instruments, lamination auxiliary operations, etc., can solve the problems of low process yield, high cost, high cost, etc., and achieve the effect of simplifying the structure and process
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no. 1 Embodiment
[0061] Figure 4 A flow chart showing a method for releasing a flexible display device according to the first embodiment of the present invention is shown. Such as Figure 4 As shown, the release method of the flexible display device of the present invention includes the following steps: forming a releaseable flexible substrate on a support carrier (step S110 ). On the releasable flexible substrate, heat treatment is performed on the first heat treatment area on the releasable flexible substrate according to a preset cutting line position for forming the flexible display device (step S120 ). Step S120 can increase the adhesive force between the first heat treatment area and the support carrier. An electronic component layer is formed on the releasable flexible substrate (step S130). A display material layer is formed on the electronic component layer (step S140). Cutting the releasable flexible substrate along the cutting line (step S150 ). The cut detachable flexible sub...
no. 2 Embodiment
[0072] Figure 7 A flow chart of a method for releasing a flexible display device according to the present invention is shown according to the second specific embodiment of the present invention. Such as Figure 7 As shown, the release method of the flexible display device of the present invention includes the following steps: forming a releaseable flexible substrate on a support carrier (step S210). On the detachable flexible substrate, heat-treat the first heat treatment area on the detachable flexible substrate according to a preset cutting line position for forming the flexible display device, so as to increase the adhesion between the first heat treatment area and the support carrier, And perform surface heating on the second heat treatment area on the detachable flexible substrate according to a preset bonding area (not shown in the figure) between the flexible circuit board and the flexible display device (step S220 ). Step S220 can increase the adhesive force between...
no. 3 example
[0092] Figure 10 According to the third specific embodiment of the present invention, it is a schematic diagram showing the preset forming position of the flexible display device on the support carrier by adopting the release method of the flexible display device of the present invention. Such as Figure 10 As shown, in order to cooperate with the manufacture of flexible display devices in large quantities, the formation positions of several flexible display devices are preset on the detachable flexible substrate 3 , and the flexible display devices are arranged in a matrix and spaced apart from each other. Each flexible display device is surrounded by cutting lines 4 . Heat treatment is performed on the first heat treatment area 6 on the releasable flexible substrate 3 according to several preset positions of the cutting lines 4 for forming the flexible display device, so as to increase the adhesion between the first heat treatment area 6 and the support carrier 1 .
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