Plating solution for electroplating copper on carbon nanotubes
A technology of carbon nanotubes and electroplating copper, which is applied in the field of electroplating copper solution, can solve the problems of limited electroless plating and no electroplating solution, and achieve the effect of simple formula and improved thermal conductivity
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Embodiment 1
[0029] 1) Aluminum-based carbon nanotubes (its structure is as figure 1 Shown, wherein 1 is aluminum foil, 2 is carbon nanotube; The scanning electron microscope picture of described carbon nanotube is as image 3 Shown, TEM picture as Figure 4 shown) soaked in alcohol for 30 minutes to remove the glue, and then washed the aluminum-based carbon nanotubes after the glue removal at room temperature;
[0030] 2) Electroplating copper on the treated aluminum-based carbon nanotubes, the composition of the plating solution and the electroplating process are as follows:
[0031]
[0032] The aluminum-based carbon nanotube composite material coated with nano-copper particles 3 on the surface obtained after electroplating is as follows: figure 2 As shown, wherein 1 is an aluminum foil, and 3 is a copper particle; the surface of the obtained material includes a carbon nanotube with a nano-copper particle 3 as shown in the scanning electron microscope Figure 5 indicated by Fig...
Embodiment 2
[0037] 1) heat-treat the aluminum-based carbon nanotubes in an oven at 250°C for 30 minutes to remove the glue, and then soak them in alcohol and deionized water for 10 minutes each to fully wet the aluminum-based carbon nanotubes;
[0038] 2) Electroplating copper on the treated aluminum-based carbon nanotubes, the composition of the plating solution and the electroplating process are as follows:
[0039]
Embodiment 3
[0041] 1) Soak the aluminum-based carbon nanotubes in acetone for 50 minutes to remove the glue, and then wash the aluminum-based carbon nanotubes at room temperature after the glue removal;
[0042] 3) Electroplating copper on the treated aluminum-based carbon nanotubes, the composition of the plating solution and the electroplating process are as follows:
[0043]
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