Power semiconductor module for integrating magnetic core of current sensor

A power semiconductor and integrated current technology, applied in the field of power semiconductor modules, can solve the problems of high cost, cumbersome dismantling of lines, slow response speed, etc., and achieve the effect of reducing subsequent use costs, realizing normal use, and increasing integration

Active Publication Date: 2016-02-17
YANGZHOU GUOYANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The disadvantages of this solution are: installing the current sensor on the busbar takes up a lot of space, and sometimes it is even necessary to bend the busbar to match the installation of the current sensor. When the current value does not need to be measured, the circuit needs to be cumbersomely removed. This method is not only not conducive to the miniaturization of the system, but also has troublesome installation, high cost and slow response speed.

Method used

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  • Power semiconductor module for integrating magnetic core of current sensor
  • Power semiconductor module for integrating magnetic core of current sensor
  • Power semiconductor module for integrating magnetic core of current sensor

Examples

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Embodiment Construction

[0017] Such as figure 1 As shown, a power semiconductor module with an integrated current sensor magnetic core includes an output electrode 1, a negative electrode 2, a positive electrode 3, a sampling control terminal 4, a bottom plate 5, a ceramic substrate 6, and a housing 7. The output electrode 1 is connected to An output electrode arm 8 arranged parallel to the direction of the bottom plate 5, the output electrode arm 8 is connected to the ceramic substrate 6, a sensor core 9 is set on the output electrode arm 8, and the sensor core 9 is an open-loop Hall current sensor core. Each phase of the AC output electrode 1 passes through a sensor core 9 . The sensor core 9 has an upwardly facing core opening.

[0018] Such as Figure 5 As shown, when current sampling is required, a matching Hall element 11 is inserted into the opening of the magnetic core, and the pin of the Hall element 11 faces upward.

[0019] Such as image 3 As shown, in order to cooperate with the ins...

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Abstract

The invention provides a power semiconductor module for integrating a magnetic core of a current sensor. The power semiconductor module comprises an output electrode, a sampling control terminal, a bottom plate, a ceramic substrate and a shell, wherein the output electrode is connected with an output electrode arm which is arranged parallel to the direction of the bottom plate; the output electrode arm is connected with the ceramic substrate; a magnetic core of a sensor sleeves the output electrode arm, and is provided with an upward magnetic core opening; and a jack is formed in the corresponding position, above the magnetic core opening, of the shell. The magnetic core of a current sensor is integrated inside the power semiconductor module, a Hall element is needed to be inserted into the magnetic core opening when current sampling is needed, the step of assembling the current sensor outside the power semiconductor module in the prior art is reduced, the integration degree, the miniature degree and the stability of the control system can be improved, and the subsequent using cost is reduced.

Description

technical field [0001] The invention relates to the field of power electronics, in particular to a power semiconductor module integrating a magnetic core of a current sensor. Background technique [0002] The topological structure of the power semiconductor module is single-tube, two-unit, six-unit, etc., and can be combined into half-bridge, three-phase full-bridge and other circuit forms according to needs. In actual use, it is often necessary to obtain the output current value. [0003] Traditional power semiconductor modules do not have the current sampling function. Therefore, when the output current needs to be measured, it is necessary to connect the AC output electrodes of the power semiconductor module to the busbar, and install a current sensor on the busbar to transmit the sampled electrical signal. to the control part. [0004] The disadvantages of this solution are: installing the current sensor on the busbar takes up a lot of space, sometimes it is even neces...

Claims

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Application Information

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IPC IPC(8): G01R15/20G01R19/00
CPCH01L2224/49111H01L2224/4846H01L2224/48472H01L2224/0603H01L2224/48139
Inventor 王玉林滕鹤松
Owner YANGZHOU GUOYANG ELECTRONICS CO LTD
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