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Protective tape and semiconductor device manufacturing method using same

A protective tape and base material technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as reducing connectivity and hindering welding, and achieve excellent connectivity.

Active Publication Date: 2016-02-17
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the aforementioned back grinding tape, when only the thermosetting resin layer is left on the wafer and the other layers are removed, the resin remains on the bumps, for example, during reflow, which hinders soldering and may reduce connectivity.

Method used

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  • Protective tape and semiconductor device manufacturing method using same
  • Protective tape and semiconductor device manufacturing method using same
  • Protective tape and semiconductor device manufacturing method using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0074]

[0075] Hereinafter, examples of the present invention will be described. In this example, a protective tape in which an adhesive layer and a thermoplastic resin layer were laminated was fabricated. Use the protective tape, and sequentially perform the protective tape sticking process (A), grinding process (B), adhesive tape sticking process (C), protective tape peeling process (D), curing process (E), cutting treatment process (F), The expansion process (G), the pick-up process (H) and the mounting process (I), thereby producing a semiconductor device. Furthermore, the solderability and bump embedding properties of the semiconductor device were evaluated. In addition, the present invention is not limited to these Examples.

[0076] [Making of protective tape]

[0077] As shown in Table 1, adhesive bond layers A1 to A3 were prepared. Adhesive layer A1 was prepared by mixing 13.0 parts by mass of film-forming resin, 54.8 parts by mass of epoxy resin, 32.4 parts by...

Embodiment 2

[0103] As shown in Table 2, the adhesive layer A2 and the thermoplastic resin layer B3 were laminated, and the protective tape whose elastic modulus ratio of the adhesive layer and the thermoplastic resin layer was 2.1E-03 was produced. Using this protective tape, a semiconductor device was produced by the above-mentioned method. At this time, the evaluation of solderability was 85%, and the evaluation of bump embedding property was "Δ".

Embodiment 3

[0105] As shown in Table 2, the adhesive layer A3 and the thermoplastic resin layer B1 were laminated, and a protective tape having an elastic modulus ratio of the adhesive layer and the thermoplastic resin layer of 3.0E-05 was produced. Using this protective tape, a semiconductor device was produced by the above-mentioned method. At this time, the evaluation of solderability was 110%, and the evaluation of bump embedding property was "◯".

[0106]

[0107] As shown in Table 2, the adhesive layer A1 and the thermoplastic resin layer B2 were laminated, and the protective tape whose elastic modulus ratio of the adhesive layer and the thermoplastic resin layer was 2.4E-02 was produced. Using this protective tape, a semiconductor device was produced by the above-mentioned method, and the evaluation of solderability at this time was 12%.

[0108]

[0109] As shown in Table 2, the adhesive layer A2 and the thermoplastic resin layer B1 were laminated, and a protective tape having...

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PUM

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Abstract

Provided are a protective tape that can achieve excellent connective properties, and a semiconductor device manufacturing method using the same. The protective tape has an adhesive layer (11), a thermoplastic resin layer (12), and a substrate film layer (13) in that order. The modulus ratio between a storage shear modulus of the adhesive layer (11) and a storage shear modulus of the thermoplastic resin layer (12), at an adhering temperature when the protective tape is adhered, is 0.01 or less. Due to this configuration, residual resin on a bump is suppressed, and thus excellent connective properties can be achieved.

Description

technical field [0001] The present invention relates to a protective tape used in the manufacture of a semiconductor device and a method of manufacturing a semiconductor device using the protective tape. This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2014-088627 for which it applied in Japan on April 22, 2014, By referring this application, it takes in this application. Background technique [0002] Conventionally, the post-process of the semiconductor manufacturing process for flip-chip mounting is performed as follows. First, an adhesive sheet or tape called a back grinding tape is attached to the protruding electrode forming surface of a wafer on which a plurality of protruding electrodes are formed, and the surface opposite to the protruding electrode forming surface is ground to a predetermined thickness in this state. After the grinding is completed, the back grinding tape is peeled off, and the wafer is diced...

Claims

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Application Information

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IPC IPC(8): C09J7/02B32B27/00H01L21/301H01L21/304C09J7/29
CPCB32B27/00H01L21/304H01L2224/13H01L2924/0002H01L21/6836C09J7/29C09J2203/326C09J2301/122C09J2301/312B32B27/06H01L2221/68318H01L2221/6834H01L2221/68327H01L21/78H01L23/3142H01L2924/00
Inventor 森山浩伸出口真吾八木秀和石松朋之
Owner DEXERIALS CORP
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