Photocurable composition and methods for optical component by using the same

一种光固化性、组合物的技术，应用在半导体/固态器件制造、光学、电气元件等方向

Active Publication Date: 2016-02-17
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, even in such methods using condensable gas, the force (mold release force) required to separate (release) the mold from the cured resist film is still large.

Method used

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  • Photocurable composition and methods for optical component by using the same
  • Photocurable composition and methods for optical component by using the same
  • Photocurable composition and methods for optical component by using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0221] [Preparation of Photocurable Composition 1]

[0222] A (meth)acrylate monomer (component (A)), a photopolymerization initiator (component (B)), and a release agent (component (C)) described below were mixed to obtain a mixed solution.

[0223] Component (A) (total: 100 parts by weight)

[0224] (A-1) Isobornyl acrylate (manufactured by Kyoeisha Chemical Co., Ltd., trade name: IB-XA): 75 parts by weight

[0225] (A-2) 1,10-Decanediol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: A-DOD-N): 25 parts by weight

[0226] Component (B)

[0227] (B-1) IRGACURE369 (manufactured by BASF): 3 parts by weight

[0228] Note that (B-1) IRGACURE369 is a compound represented by the following formula (1), which is (2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 ).

[0229] [chemical formula 12]

[0230]

[0231] Component (C)

[0232] (C-1) Megaface EXP.TF-2067 (manufactured by DIC Corporation, nonionic fluorine-based surfactant): 1.1 parts...

Embodiment 2

[0238] [Preparation of Photocurable Composition 2]

[0239] Except using 2.0 parts by weight of (C-2) BLAUNONSA-30 / 702000R (manufactured by Aoki Oil Industrial Co., Ltd., non-ionic alkyl-based surfactant) as a release agent (component (C)), as in Example 1 Prepare photocurable composition 2.

[0240] (Measurement of release force)

[0241] The average release force was measured as in Example 1 except by using Photocurable Composition 2. The average release force is 13N. This value was lower than when the photocurable composition of the comparative example described below was used.

Embodiment 3

[0243] [Preparation of Photocurable Composition 3]

[0244] A photocurable composition 3 was prepared as in Example 1 except that 0.8 parts by weight of (C-3) Pluriol A760E (manufactured by BASF, methyl polyethylene glycol) was used as a release agent (component (C)).

[0245] (Measurement of release force)

[0246] The average release force was measured as in Example 1 except by using Photocurable Composition 3. The average release force is 17N. This value was lower than when the photocurable composition of the comparative example described below was used.

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Abstract

In an imprint method in a condensable gas atmosphere, the force (mold releasing force) required to separate a mold from a resist cured film (mold release) has been large. A photocurable composition for performing imprint in an atmosphere containing a condensable gas includes a component (A) which is a (meth)acrylate monomer; a component (B) which is a photopolymerization initiator; and a component (C) which is a mold releasing agent. The saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 50% by weight or more, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.

Description

technical field [0001] The present invention relates to a photocurable composition, a method for producing a film, an optical component, a circuit board, and an electronic component using the photocurable composition, and a cured product. Background technique [0002] The demand for miniaturization of semiconductor devices and microelectromechanical systems (MEMS) has increased the need for existing photolithography and a technique called photoimprinting in which a mold is used to shape a resist (photocurable composition) on a wafer, Attention to the combination of nanofabrication techniques to form resist patterns on the substrate. According to this technology, sub-ten nanometer-order fine structures can be formed on a substrate. In the photoimprint system, a resist is first applied to a pattern-forming region on a substrate, and then the resist is shaped by using a mold on which a pattern has been formed in advance. The resist is then irradiated with light to be cured, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027B29C59/02C08F2/44C08F2/50
CPCC08F2/44C08F2/50G03F7/0002H01L21/0271H01L21/266C08K2201/00B29C33/62C08F222/102C08F220/1811B29C59/002B29C59/005B29C59/026B29K2033/08B29K2105/0005C08L33/08
Inventor 本间猛伊藤俊树米泽诗织千叶启子山下敬司
Owner CANON KK
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