Fixing ring capable of automatically giving alarm when damaged

Abstract

The invention discloses a fixing ring capable of automatically giving an alarm when damaged. The fixing ring comprises a fixing ring body which is wholly in a sheet type circular ring shape, and a plurality of grooves are formed in the lower surface of the fixing ring body. An annular thin wire is embedded into the fixing ring body, and the two ends of the annular thin wire are connected with a resistance monitoring device. The resistance monitoring device detects resistance information of the annular thin wire in real time, and is electrically connected with the computer control end of an external polishing machine. Or, a plurality of annular wires are embedded into the fixing ring body, fixed point voltages have access to the two ends of each annular wire, each annular wire is further connected with a current signal monitoring device, and the current signal monitoring devices detect current information of the annular wires in real time and are electrically connected with the computer control end of the external polishing machine. According to the technical scheme, the fixing ring can automatically give an alarm and trigger the polishing machine to automatically stop rotating when damaged, and the damage degree can be automatically recognized; and the failure level can be positioned conveniently and fast, and potential risks and economic losses caused by breakage of the fixing ring are effectively reduced.

Description

technical field [0001] The invention relates to the technical field of CMP technology for wafer surface flattening, in particular to a fixing ring that can automatically alarm when damaged. Background technique [0002] With the development of semiconductor manufacturing technology, while the critical dimensions of integrated circuits are getting smaller and smaller, the size of wafers is getting bigger and bigger, and the value of single wafers is getting higher and higher. Therefore, in the chemical process of wafer processing During mechanical planarization, the thickness of the retaining ring has a great influence on the grinding rate and stability. Among them, the fixing ring is a commonly used equipment component in wafer production. Its main function is to: fix the wafer, prevent slippage during the grinding process of the wafer; make the pressure on the edge of the wafer adjustable, and reduce the amount of grinding on the edge of the wafer. Adjustable; the groove o...

AI Technical Summary

Problems solved by technology

[0003] In the process of wafer processing, once fragments occur, the economic loss to the factory is also increasing.

There are many factors that cause the wafer to break during the processing process. The fixed ring on the polishing head breaks during the polishing process and causes the wafer to break. If it cannot be found in time and stop the operation of the polishing machine, Not only will it cause wafer fragmentation, but it may even cause serious damage to other components such as polishing heads and polishing pads, resulting in higher economic losses

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