Precursor time-separated preparation method of bismuth aluminate thin film
A technology of time separation and precursors, applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problem that bulk materials cannot be applied to the field of microelectronics, are not suitable for devices, integrated circuits, and lack of preparation technology, etc. question
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Embodiment 1
[0078] A) dry the cleaned substrate material with an inert gas, and place it in a substrate tray;
[0079] B) The tray and the substrate are moved into the vacuum reaction chamber, the vacuum pump is turned on through the equipment controller, and then the automatic valve AK4 at the air inlet of the vacuum pump is opened to vacuumize the vacuum reaction chamber;
[0080] C) Bismuth precursor source 1, aluminum precursor source 2, oxygen precursor source 3, and inert gas 4 are tris(2,2,6,6-tetramethyl-3,5-heptanedionate) bismuth ( III), tri-tert-butylaluminum, H 2 O, N with a purity of more than 99.9995% 2 (nitrogen);
[0081] Set the temperatures of bismuth precursor source 1, aluminum precursor source 2, and oxygen precursor source 3 on the equipment controller to 180°C, 25°C, and 15°C respectively, and the equipment controller controls the temperature of bismuth precursor source 1, aluminum precursor source The electric heater of the container of body source 2, oxygen pre...
Embodiment 2
[0111] A) dry the cleaned substrate material with an inert gas, and place it in a substrate tray;
[0112] B) The tray and the substrate are moved into the vacuum reaction chamber, the vacuum pump is turned on through the equipment controller, and then the automatic valve AK4 at the air inlet of the vacuum pump is opened to vacuumize the vacuum reaction chamber;
[0113] C) Bismuth precursor source 1, aluminum precursor source 2, oxygen precursor source 3, and inert gas 4 are trimethylbismuth, trimethylaluminum, H 2 O, N with a purity of more than 99.9995% 2 (nitrogen);
[0114] Set the temperature of bismuth precursor source 1, aluminum precursor source 2, and oxygen precursor source 3 on the equipment controller to 25°C, 25°C, and 15°C respectively, and the equipment controller controls the temperature of bismuth precursor source 1, aluminum precursor source The electric heater of the container of body source 2, oxygen precursor source 3 and / or the working state of semicon...
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