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Thermally conductive sheet

A technology of thermal conductivity and sheet materials, which is applied in the direction of heat exchange materials, semiconductor devices, semiconductor/solid-state device components, etc. Hard and brittle problems, to achieve the effect of improving adhesion, reducing thermal resistance, and improving thermal conductivity

Active Publication Date: 2016-03-02
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Thermally conductive sheets are generally filled with a large amount of thermally conductive inorganic fillers to increase the thermal conductivity of the sheet (for example, refer to Patent Documents 4 and 5). However, if the filling amount of inorganic fillers is increased, the sheet will become hard and brittle
In addition, for example, when a silicone-based thermally conductive sheet filled with a large amount of inorganic filler is left in a high-temperature environment for a long time, the thermally conductive sheet becomes hard and thick, resulting in poor thermal conductivity when a load is applied. The thermal resistance of the sheet increases

Method used

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Examples

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preparation example Construction

[0051] 2. Preparation method of thermally conductive sheet

[0052] 3. Other preparation methods of thermally conductive sheets

[0053] 4. Embodiment

[0054]

[0055] Next, the curable resin composition, thermally conductive fibers, thermally conductive particles, etc. constituting the thermally conductive sheet according to the present embodiment will be described.

[0056] The thermally conductive sheet according to this embodiment contains a curable resin composition, thermally conductive fibers, and thermally conductive particles, and has a compressibility of 40% or more.

[0057] In addition, the thermally conductive sheet according to this embodiment contains a curable resin composition, thermally conductive fibers, and thermally conductive particles, and the filling amount of the thermally conductive particles and thermally conductive fibers is 70% by volume or less.

[0058] Specifically, the filling amount of thermally conductive particles and thermally conducti...

Embodiment 1

[0133] In Example 1, as shown in Table 1, 20.4% by volume of thermally conductive particles were subjected to coupling treatment with a silane coupling agent with an average particle diameter of 5 μm of alumina particles, and the average particle diameter of 24% by volume was Aluminum nitride particles of 1 μm and 22.3% by volume of pitch-based carbon fibers having an average fiber length of 50 μm as thermally conductive fibers were mixed in a two-component addition reaction type liquid silicone resin to prepare a silicone resin composition.

[0134] Use a two-component addition reaction liquid silicone resin with organopolysiloxane as the main component, and make the ratio of silicone main agent A to curing agent B (silicon main agent A: curing agent B) 6 : 4 for mixing.

[0135] The obtained silicone resin composition was extruded into a hollow rectangular columnar metal mold (35 mm×35 mm) to form a 35 mm□ silicone molded product. The silicone molded product was heated in a...

Embodiment 2

[0137] In Example 2, as shown in Table 1, except that the ratio of silicone main agent A to curing agent B (silicon main agent A: curing agent B) is 55:45 to form a two-component additive A thermally conductive sheet was produced in the same manner as in Example 1 except that the reaction-type liquid silicone resin was used.

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Abstract

Provided is a thermally conductive sheet which has excellent flexibility and good thermal conductivity in the thickness direction. This thermally conductive sheet contains a curable resin composition, thermally conductive fibers and thermally conductive particles, and has a compressibility of 40% or more. In addition, the amount of the thermally conductive particles filled therein is 70 vol% or less. This thermally conductive sheet is capable of improving adhesion between various heat sources and heat dissipation members by eliminating the difference in level therebetween, and is thus capable of improving the thermal conductivity in the thickness direction of the sheet. In cases where the thermally conductive sheet is used in a high temperature environment for a long period of time, the adhesion is improved, thereby achieving a decrease in the thermal resistance.

Description

technical field [0001] The present invention relates to a heat conductive sheet that promotes heat dissipation of exothermic electronic components and the like. This application is based on Japanese Patent Application No. 2013-145035 filed in Japan on July 10, 2013, and Japanese Patent Application No. 2014-086432 filed on April 18, 2014, and claims priority, and is incorporated by reference to these applications References are made in this application. Background technique [0002] Along with higher performance of electronic equipment, higher density and higher mounting of semiconductor elements are progressing. Along with this, it has become particularly important to efficiently dissipate heat generated by electronic components constituting electronic equipment. In order to dissipate heat more effectively, semiconductors are mounted on heat sinks such as cooling fans and heat sinks with the help of thermally conductive sheets. As the heat conductive sheet, a sheet obtain...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/36
CPCC08K3/22C08K3/28C08K7/06C08K9/06C08K2003/2227C08K2003/282C08L2203/20C09K5/14H01L23/367H01L23/3737C08L83/04B29C48/0022C08G77/12C08G77/20H01L2924/0002H01L2924/00C08L83/00C08K3/04B29L2031/18H01L23/3675H01L23/3733
Inventor 荒卷庆辅石井拓洋伊东雅彦内田信一芳成笃哉内田俊介
Owner DEXERIALS CORP