A flexible circuit board production line

Abstract

The invention proposes a flexible printed circuit board production line. The production line comprises a dual-column unwinding machine, a dual-column development section, a dual-column vacuum etching section, a dual-column film withdrawal section and a dual-column winding machine, wherein the dual-column unwinding machine and the dual-column winding machine are cooperatively used for unwinding and winding a flexible printed circuit board; the dual-column development section comprises a development machine and is used for removing a non circuit region covering film on the flexible printed circuit board to expose a circuit and making preparations for etching; the dual-column vacuum etching section is used for etching the flexible printed circuit board; a vacuum etching machine is arranged on the dual-column vacuum etching section; a post-etching water-washing section is arranged behind the vacuum etching machine; the dual-column film withdrawal section is used for removing the covering film on the flexible printed circuit board; a film withdrawal machine is arranged on the dual-column film withdrawal section; and a post-film-withdrawal water-washing section is arranged behind the film withdrawal machine. According to the production line, the quality and efficiency of FPC board production are improved and the occupied factory space of devices is reduced.

Description

technical field [0001] The invention relates to a development-etching-film-stripping-production line, which adopts a roll-to-roll production mode and a double-row production structure, and adopts a vacuum etching method in the etching section, which can further improve the etching uniformity. Its main application In the flexible circuit board (FPC) industry, it is used for the production of flexible boards. Background technique [0002] With the continuous development of domestic information technology, there is a higher demand for the printed circuit board industry. FPC is a printed circuit board with high reliability and excellent flexibility. This kind of circuit can be bent and folded at will. , light weight, small size, good heat dissipation, easy installation, breaking through the traditional concept of interconnection technology. As a new product that can meet the requirements of three-dimensional assembly such as thinness, lightness, and flexibility, flexible circui...

AI Technical Summary

Problems solved by technology

[0005] Disadvantage 1: Due to the pool effect in the etching process, the etching uniformity of the circuit board in the etching section cannot be further improved

[0006] Disadvantage 2: The sheet-to-sheet production method cannot realize the roll-to-roll production of FPC boards, and the production cannot be continuous. The sheet-like thin plates are easy to jam, easy to bend corners, high scrap rate, and low efficiency.

[0007] Disadvantage 3: For thinner FPC boards, traditional sheet-to-sheet production equipment cannot produce, and only roll-to-roll production methods can be used

[0009] Disadvantage 1: Due to the pool effect in the etching process, the etching uniformity of the circuit board in the etching section cannot be further improved

[0010] Disadvantage 2: Only single-row production method is adopted, the production efficiency is low, and the equipment cost is high

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