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a bonding wire

A technology of bonding wire and alloy wire, which is applied in the field of bonding wire, can solve the problems of low oxidation resistance, high cost of bonding gold wire, and low manufacturing cost of silver alloy wire, etc., achieve strong oxidation resistance and solve the problem of migration Problems, good performance and stability

Active Publication Date: 2017-12-26
北京达博有色金属焊料有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of gold is expensive, and the cost of bonding gold wire is relatively high. In order to meet market requirements, substitutes for bonding gold wire have been introduced, such as silver alloy wire and gold-plated silver alloy wire.
The manufacturing cost of silver alloy wire is lower, but its resistance to oxidation and vulcanization is lower, so it can only replace gold wire in low-end products
Relatively speaking, gold-plated silver alloy wire can be a better substitute for gold wire. It is coated with a layer of gold on the surface of silver alloy wire, which does improve the anti-oxidation and vulcanization performance of the product without affecting its bonding. However, due to The atomic structure of gold is very similar to that of silver, so gold plating on the surface of silver alloy wire cannot solve the problem of silver migration, and the performance stability of electronic packaging is poor, so gold-plated silver alloy wire still cannot completely replace gold wire

Method used

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preparation example Construction

[0020] The steps of the preparation method of bonding wire of the present invention are as follows:

[0021] (1) Vacuum melting of gold, silver and palladium according to the mass ratio (5-20): (60-94): (1-20), drawing and casting into alloy wire rods with a diameter of 10-6mm, through large and medium Pulling and then micro-drawing until the diameter is 40-80μm to obtain the bonding wire matrix;

[0022] (2) Gold plating on the bonding wire substrate, wherein the mass of the gold coating is 1wt%-5wt% of the mass of the bonding wire substrate;

[0023] (3) ultrasonically cleaning the alloy wire in step (2), and plating palladium on the gold coating, wherein the quality of the palladium coating is 1wt%-5wt% of the sum of the bonding wire substrate and the gold coating mass;

[0024] (4) ultrasonically cleaning the alloy wire in step (3), and plating platinum on the palladium coating, wherein the quality of the platinum coating is 4wt%-10wt% of the sum of the mass of the bondin...

Embodiment 1

[0030] (1) Vacuum melting of gold with a purity of 99.999% or more, silver with a purity of 99.99% or more and palladium with a mass ratio of 99.99% or more is 5:94:1, and cast into an alloy wire rod with a diameter of 10~6mm. , middle drawing, and then micro drawing to a diameter of 80 μm to obtain a bonded wire matrix.

[0031] (2) A layer of gold is electroplated on the bonding wire substrate by a cyanide-free electroplating method, the purity of the gold is more than 99.999%, and the mass of the gold plating layer is 1wt% of the mass of the bonding wire substrate.

[0032] (3) Ultrasonic cleaning is carried out on the alloy wire in step (2), and a layer of palladium is electroplated on the gold coating by the method of cyanide-free electroplating. The purity of palladium is more than 99.99%, and the quality of the palladium coating is the bonding wire substrate and the gold coating. 1wt% of the sum of mass.

[0033] (4) Ultrasonic cleaning is performed on the alloy wire i...

Embodiment 2

[0036] (1) Vacuum melting of gold, silver and palladium according to the mass ratio of 20:60:20, drawing and casting into alloy wire rods with a diameter of 10~6mm, through large, medium and then micro drawing to a diameter of 40, to obtain bond Synthetic matrix;

[0037] (2) Gold-plated on the bonding wire substrate, the purity of gold is more than 99.999%, and the quality of the gold coating is 5wt% of the mass of the bonding wire substrate;

[0038] (3) Ultrasonic cleaning is performed on the alloy wire in step (2), and palladium is plated on the gold coating, the purity of palladium is more than 99.99%, and the quality of the palladium coating is 5wt% of the sum of the bonding wire matrix and the gold coating quality;

[0039] (4) Perform ultrasonic cleaning on the alloy wire in step (3), and plate platinum on the palladium coating. The purity of platinum is more than 99.99%, and the quality of the platinum coating is 10wt of the sum of the bonding wire matrix, gold coatin...

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Abstract

The invention discloses a bonding wire. The bonding wire is composed of a bonding wire substrate and a three-layer coating coated outside the bonding wire substrate. The bonding wire substrate is a gold-silver-palladium alloy, and the three-layer coating is from inside to outside. Gold plating, palladium plating, and platinum plating are in order, and the thickness of the platinum plating is the thickest among the three layers of plating. The bonding wire of the present invention has a three-layer coating structure, has strong oxidation and sulfidation resistance, can solve the problem of silver migration, has good performance stability in the back-end of electronic packaging, and has low preparation cost, and can completely replace gold wires.

Description

technical field [0001] The invention relates to a bonding wire, in particular to a bonding wire with a three-layer coating structure and a preparation method thereof. Background technique [0002] At present, most of the connections between semiconductor electronic chips in integrated circuits and external lead frames are completed by bonding wires, which is the so-called wire bonding. The process is to fix the bonding wire through a special ceramic nozzle on the bonding equipment, leaving a certain length of bonding wire at the tail, and then melt the tail of the bonding wire into a ball through external arc discharge, and then use the ceramic nozzle The spherical bonding wire is extruded and connected to the electrode of the electronic chip, and finally the other end of the bonding wire is connected to the external lead frame by friction through the movement of the bonding equipment, and it is completed after being encapsulated by plastic resin. To ensure the smooth progr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L21/60C22C5/06C25D5/10C25D3/50
CPCC22C5/06C25D3/50C25D5/10H01L23/48H01L24/01H01L24/42H01L24/43H01L24/44H01L2224/01H01L2224/43H01L2224/42H01L2224/44H01L2224/4321H01L2224/4381H01L2224/43825H01L2224/45139H01L2224/45573H01L2224/45644H01L2224/45664H01L2224/45669H01L2924/00011H01L2224/45144H01L2224/45H01L2924/01079H01L2924/01046H01L2924/013H01L2924/01204H01L2924/01205H01L2924/00013H01L2924/00012H01L2924/00H01L2924/01005H01L2924/01049
Inventor 梁忠谢允昊闫茹向翠华周晓光苏宏福
Owner 北京达博有色金属焊料有限责任公司
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