HDI circuit board blind hole offset anti-fool test method

Abstract

The present invention provides an HDI circuit board blind hole deviation fool-proof testing method. The method comprises the following steps: providing an HDI circuit board; manufacturing a blind hole deviation fool-roof testing region on a process edge of the HDI circuit board, wherein the blind hole deviation fool-proof testing region comprises a testing blind hole, a plurality of conducting blind holes, an isolation ring and a testing point, the testing blind hole is located at a center position of the isolation ring, the plurality of conducting blind holes are disposed around the isolation ring, and the testing point and the isolation ring are arranged at an interval; performing blind hole deviation detection on the blind hole deviation fool-proof testing region, and testing conductivity of the testing blind hole and the testing point; and determining whether a blind hole is deviated according to the conductivity of the testing blind hole and the testing point in the blind hole deviation testing region. Compared with the related prior, the HDI circuit board blind hole deviation fool-proof testing method has the advantages of simplicity for operation, high accuracy and high testing efficiency.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a fool-proof test method for blind hole deviation of HDI circuit boards. Background technique [0002] High Density Interconnection (HDI) circuit board is a high-end printed circuit board product, and its purpose is to meet the needs of electronic products in the direction of miniaturization, high frequency and high speed, and multi-function. HDI circuit boards promote the development of high integration and high intelligence in the design and manufacture of electronic systems, and have been widely used in high-end electronic products such as aerospace technology, medical equipment, and consumer products. The production of blind vias is one of the most critical steps in the production process of HDI rigid-flex boards, and it is the main way to realize interlayer interconnection. Therefore, improving the technology of making blind holes is very important for improving the qu...

AI Technical Summary

Problems solved by technology

[0003] At present, due to the higher density of blind holes and smaller spacing between pads on HDI circuit boards, the difficulty of making HDI circuit boards has increased.

When the area of ​​the sub-outer chassis of the HDI circuit board is small, due to the influence of alignment accuracy and cumulative tolerance, the laser blind hole is prone to the phenomenon of partial inner chassis. There is a connection short circuit, which can be found during the conductive test; but when the deviation of the blind hole is small, half of the bottom hole of the blind hole is located outside the chassis, and does not form a short circuit with the sub-outer layer pattern. This kind of abnormality cannot be detected using conventional conductive test equipment. For measurement, only after the customer’s plug-in is completed, do the relevant cold and heat cycle test. When there is water vapor in the blind hole, the blind hole will be short-circuited with the underlying graphics, resulting in functional scrapping of the customer’s client, and the factory faces huge claims.

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