Device position indicating system and device position indicating method

Abstract

Disclosed is a device position indication system, comprising an operation apparatus, a control apparatus, a support apparatus, an image capture apparatus, a position indication apparatus and a bearing member, wherein the operation apparatus is in communication connection with the control apparatus; the image capture apparatus and the position indication apparatus can both be slidably fixed on the support apparatus, and are both in communication connection with the control apparatus; and the image capture apparatus and the position indication apparatus are both arranged opposite to the bearing member. The image capture apparatus transmits a photographed pattern of a plate member mounted on the bearing member to the operation apparatus. The operation apparatus completes high-precision integration of a photographed image and a coordinate system, and controls, by outputting a signal to the control apparatus, a high-precision location indication of the position indication apparatus for a material to be assembled, so that the high efficiency and high precision of device mounting are ensured, and the occurrence of the problems of wrong material and parts missing is avoided, thereby improving the production efficiency of an enterprise and saving the costs.

Description

technical field [0001] The invention relates to the technical field of SMT packaging devices, in particular to a device position indicating system and a device position indicating method. Background technique [0002] Electronic circuit surface mount technology (Surface Mount Technology, SMT), known as surface mount or surface mount technology. It is a kind of non-lead or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface of the printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, through Circuit assembly and connection technology that is soldered and assembled by methods such as reflow soldering or dip soldering. At present, in the tail process of SMT processing and manufacturing, a large amount of bulk materials are produced during the manufacturing process and are not cleaned up in time, resulting in a very long billing time. Moreover, there are many materials of various specifi...

AI Technical Summary

Problems solved by technology

At present, in the tail process of SMT processing and manufacturing, a large amount of bulk materials are produced during the manufacturing process and are not cleaned up in time, resulting in a very long billing time. Moreover, there are many materials of various specifications, which cannot be placed in the SMT or plug-in Make sure to find the position accurately in multiple operations, it is easy to paste the wrong position, resulting in wrong material

In addition, when DIP is making the first piece or a small batch of prototypes, when there are many types of single-board components, it is also prone to misjudgment of positions, resulting in the problem of wrong materials, which greatly affects production efficiency and increases the production cost of enterprises.

Images