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Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board

A production method and circuit board technology, which is applied in multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of resin filling ability influence, copper foil wrinkling, copper foil sinking, etc., to avoid local nonlinear expansion Shrinkage or deformation, sufficient glue flow, and smooth glue flow

Inactive Publication Date: 2016-04-13
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the glue content of PP (prepreg) is less, the filling ability of the resin will be affected, and it is difficult to fully fill a large amount of blank space with a small amount of resin, and the air in the blank space has been discharged during the lamination process due to thermal expansion and contraction, cooling Finally, a partial vacuum state will inevitably appear, causing the copper foil on the surface to sink and cause copper foil to wrinkle

Method used

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  • Single-layer circuit board, high-layer circuit board and fabrication method of high-layer circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0027] refer to figure 1 , a single-layer circuit board 1 described in this embodiment includes a core board 11 and a copper frame 12 arranged on the outer edge of the core board; The blank area 112 of the upper surface and the lower surface of the core board is provided with several evenly distributed pads 13, and there is a gap between adjacent pads 13; the upper surface of the copper frame 12 Several uniformly distributed glue guide grooves 121 are provided on the lower surface and the center line of the several glue guide grooves 121 intersects with the geometric center of the core plate 11 so that they can be arranged radially around the geometric center of the core plate 11.

[0028] A high-layer circuit board, comprising at least two or more laminated single-layer circuit boards 1 . The positions of the pads 13 between two adjacent single-layer circuit boards 1 are staggered along the lateral direction, so as to avoid overlapping of copper-free regions. The positions ...

Embodiment 2

[0036] The characteristics of this embodiment are: the diameter of the pads is 2 mm; on the same single-layer circuit board, the distance between adjacent pads is 0.87 mm, and the distance between centers is 2.87 mm. Others are the same as in Example 1.

Embodiment 3

[0038] The characteristics of this embodiment are: the diameter of the pads is 2 mm; on the same single-layer circuit board, the distance between adjacent pads is 0.87 mm, and the distance between centers is 2.87 mm. Others are the same as in Example 1.

[0039] Other examples:

[0040] The characteristics of the described embodiment are: the blank area 112 on the upper or lower surface of the core board is provided with several evenly distributed pads 13; the upper or lower surface of the copper frame 12 is provided with several evenly distributed The glue guide groove 12. Others are the same as in Example 1.

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Abstract

The invention discloses a single-layer circuit board, a high-layer circuit board and a fabrication method of the high-layer circuit board. The single-layer circuit board comprises a core board and a copper frame, wherein the copper frame is arranged at an outer edge of the core board, the core board comprises a pattern region and a blank region, wherein the pattern region is arranged at a middle part, the blank region is arranged at the periphery of the pattern region, a plurality of bonding pads are uniformly arranged on the blank region of the upper surface and / or the lower surface of the core board, a distance is reserved between adjacent bonding pads, a plurality of adhesive guide grooves are uniformly arranged on the upper surface and / or the lower surface of the copper frame, and the central line of the plurality of adhesive guide grooves is intersected with a geometric center of the core board so that the plurality of adhesive guide grooves can be radially arranged around the geometric center of the core board. By the single-layer circuit board, the adhesive flowing performance during the lamination process can be effectively improved, resin adhesive flowing among layers is more complete and uniform, so that a copper foil is laminated to be corrugated by the high-layer circuit board.

Description

technical field [0001] The invention relates to a single-layer circuit board, a high-level circuit board and a method for manufacturing a high-level circuit board, belonging to the technical field of circuit board processing. Background technique [0002] At present, the technological progress of high-level circuit board products provides high-quality products for the electronic and electrical industry, communication industry, automobile industry and related industries. The high-level circuit board is made of multiple core boards that have been made with inner layer graphics, and the core boards of each level are pressed together in a press with epoxy resin to form a multi-layer PCB. As an important part of the PCB processing process, lamination is related to the impedance of the board, the integrity of the lines, the curing degree of the resin, and affects the subsequent drilling and desmearing, which plays a very important role in the reliability of the board. effect. In...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/46
CPCH05K1/0271H05K1/11H05K3/4617H05K2201/09036H05K2201/09427
Inventor 邱勇萍李艳国陈蓓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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