Lightweight radiator and manufacturing method thereof
A manufacturing method and radiator technology, which are applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., can solve problems such as low life of LED chips, and achieve small quality and small envelope volume. , The effect of large heat dissipation area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0027] figure 1 It is a structural schematic diagram of a lightweight radiator, such as figure 1 As shown, a lightweight radiator, including:
[0028] A metal substrate 1, on which the LED lamp is arranged;
[0029] Several metal wires 2 are arranged on the metal substrate 1 .
[0030] Specifically, the metal substrate 1 is flat, and the metal wires 2 are evenly fixed on the metal substrate 1 . In the prior art, the fins on the back of the metal are usually used to increase the heat dissipation area. However, with the increasing heat density of electronic devices, the heat dissipation requirements are also increasing. Therefore, in this embodiment, a number of metal wires 2 are densely arranged on the surface of the metal substrate 1 , and the metal wires 2 are used to increase the heat dissipation area, thereby increasing the heat dissipation surface area of the heat sink to achieve a better heat dissipation effect.
[0031] Preferably, in this embodiment, the metal wir...
Embodiment 2
[0043] According to the light-weight heat sink provided by the above-mentioned embodiments, this embodiment proposes a manufacturing method of the light-weight heat sink.
[0044] figure 2 It is a schematic flow chart of a manufacturing method of a lightweight radiator, such as figure 2 Shown, a kind of manufacturing method of lightweight radiator, comprises steps:
[0045] A1: preparing a metal substrate 1;
[0046] A2: preparing several wavy metal wires 2;
[0047] A3: cleaning the metal substrate 1 to ensure that the surface of the metal substrate 1 is clean;
[0048] A4: uniformly plant the metal wires 2 on the metal substrate 1 .
[0049] Specifically, when manufacturing a lightweight heat sink, it is first necessary to prepare a metal substrate 1 and several wavy metal wires 2. It is worth pointing out that the size of the metal substrate 1 is 60×60 mm, and the diameter of the metal wire 2 does not exceed 0.5mm, the optimum is 0.5mm. After the metal substrate 1 is ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Diameter | aaaaa | aaaaa |
| Height | aaaaa | aaaaa |
| Height | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More