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Power supply EBG structure based on open-loop resonator and X-shaped bridge

A ring resonator and open-loop resonance technology, which is applied to printed circuit components and printed electrical components, can solve the problem of high cost, achieve low cost, high cut-off frequency, and ensure integrity

Inactive Publication Date: 2016-04-20
CHANGSHU KAIXI ELECTRONICS & ELECTRICAL CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

[0006] Aiming at the shortcomings of most EBG structures using 3-4 metal layers to suppress high-frequency noise, but high cost, a power EBG structure based on open-loop resonators and X-bridges is proposed

Method used

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  • Power supply EBG structure based on open-loop resonator and X-shaped bridge
  • Power supply EBG structure based on open-loop resonator and X-shaped bridge
  • Power supply EBG structure based on open-loop resonator and X-shaped bridge

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Embodiment

[0025] Such as figure 1 As shown, the power EBG structure based on the open-loop resonator and the X-bridge includes two metal layers and a dielectric layer (2), the dielectric layer (2) is located between the two metal layers, and the upper metal layer (1) is the power supply layer, and the lower metal layer (3) is the ground layer. The power EBG structure of the present invention adopts two metal layers, and the medium layer is between the two metal layers. Compared with most power EBG structures that use 3-4 metal layers , which has the advantages of less circuit board layers and low cost.

[0026] The upper metal layer (1), that is, the power layer, uses an etched open-loop resonator as the periodic unit of the EBG structure. The open-loop resonators are connected by an X-shaped bridge, and the lower metal layer (3) uses a complete metal plane. Such as figure 2 As shown, the introduction of the open-loop resonator can reduce the damage to the power plane and ensure the ...

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Abstract

The invention provides a power supply EBG structure based on open-loop resonators and an X-shaped bridge. The power supply EBG structure comprises two metal layers and one dielectric layer, wherein the dielectric layer is arranged between the two metal layers; the upper metal layer is a power supply layer; the lower metal layer is a ground layer; the upper metal layer, namely the power supply layer, utilizes etching open-loop resonators as periodical units of an EBG structure; the open-loop resonators are connected through an X-shaped bridge; the lower metal layer utilizes a complete metal plane; and the open-loop resonators are adjusted by means of adjusting of the size of the open-loop resonators. For the power supply EBG structure based on open-loop resonators and an X-shaped bridge, two metal layers are utilized to design the EBG structure and the periodical units of the structure utilize complementary open-loop resonators and uses the X-shaped bridge to connect the periodical units so as to increase the bandwidth of a stop band and restrain the depth, so that effective suppression of electromagnetic noise can be realized in a broadband range.

Description

technical field [0001] The invention is a novel ultra-broadband power supply EBG structure, which belongs to the field of electronic information technology. It is mainly used for the power supply plane of high-speed / microwave printed circuit, suppresses the electromagnetic interference noise between the power supply / ground plane, and realizes good power supply integrity . Background technique [0002] Modern circuit systems integrate digital circuits, radio frequency circuits, analog circuits, etc. The integration density is getting higher and higher, and the operating frequency is getting higher and higher. The electromagnetic interference of the power supply and ground network is also becoming more and more obvious, which has a bad impact on the performance of the system. , must be suppressed. In the power ground network, a plane pair structure is formed between the power plane and the ground, and various resonances are generated within a certain frequency range. In addi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/16
Inventor 李晓春
Owner CHANGSHU KAIXI ELECTRONICS & ELECTRICAL CO LTD
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