Light emitting diode (LED) chip electrode structure capable of promoting transverse current diffusion and with dual reflection surfaces
A LED chip and electrode structure technology, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of poor reflection effect, low reflectivity, and poor light extraction effect, so as to increase light output efficiency and promote Diffusion, increasing the effect of lateral diffusion
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[0021] Such as figure 1 As shown, the present invention includes a layer of Cr layer 1, a first layer of Al 2, a first pair of TiN / Pt layers 3, a second pair of TiN / Pt layers 4, an Au layer 5, The second Al layer 6 and the TiN outer layer 7 constitute the electrode extension bar with trapezoidal structure.
[0022] Wherein, the thickness of the Cr layer is 10-50 angstroms.
[0023] The thickness of the first Al layer is 1000˜5000 angstroms.
[0024] In each pair of TiN / Pt layers, the thickness of TiN is 500-2000 angstroms, and the thickness of Pt is 500-2000 angstroms.
[0025] The thickness of the Au layer is 5000-20000 angstroms.
[0026] The electrode structure of the present invention is applied to conventional parallel electrode structure design such as figure 2 shown.
[0027] The electrode structure of the present invention is applied to the design under the situation that the MESA is wrapped by the N electrode extension strip, such as image 3 shown. Its double...
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