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A distributed computer with integrated computing and storage

A distributed computer and integrated technology, which is applied in the direction of computers, multiple digital computer combinations, digital computer components, etc., can solve problems such as no design and implementation, and achieve the effects of reduced power consumption, increased speed, and reduced computing burden

Active Publication Date: 2018-10-19
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the specific architectural design for this concept is still being explored, and there is no specific design implementation yet.

Method used

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  • A distributed computer with integrated computing and storage
  • A distributed computer with integrated computing and storage
  • A distributed computer with integrated computing and storage

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Embodiment Construction

[0023] The implementation of the present invention will be described in detail below in conjunction with the drawings and examples.

[0024] Such as figure 1 As shown, on the basis of the traditional computing architecture, an additional computing unit is placed close to the memory. This computing unit may be an MPCU (massively parallel computing unit), responsible for completing a large number of computing tasks. The CPU in the architecture is only responsible for running the operating system to implement simple control operations. Such as figure 1 , MPCU and DDR memory are packaged in the same chip using 3D packaging technology. That is to say, MPCU corresponds to the part of logic circuit layer (Logic Die) in HMC.

[0025] figure 2 The overall design idea of ​​the integrated architecture of computing and storage is given. The whole architecture includes a non-computing processor core (Computation Light Core), a large-scale parallel computing unit (MassiveParallel Comp...

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Abstract

A computation and storage integrated distributed computer architecture comprises a central processing unit and one or more computation units. The computation units are encapsulated in DDR chips on the basis of a 3D encapsulation technology. Each DDR chip encapsulates multiple layers of DRAMs and a logic circuit layer. Each logic circuit layer comprises a DMA and one or more computation units. The computation units directly have access to the DRAMs, and the central processing unit has access to the DARMs through a storage controller by means of a layered storage system. The central processing unit and the computation units achieve quick block data exchange trough the DMAs. An operation system runs on the central processing unit, necessary control operation is achieved, and the computation units are responsible for completing computation tasks. The computation and storage integrated distributed computer architecture is based on the 3D encapsulation technology, interactive configuration of the computation units and the central processing unit is achieved, an integrated computation mode is converted into a distributive computation mode, and the burden of the central processing unit is greatly reduced.

Description

technical field [0001] The invention belongs to the field of computer architecture, and relates to an architecture integrating computing and storage and a programming model design for the architecture, in particular to a distributed computer integrating computing and storage. Background technique [0002] In recent decades, the rapid development of processors and memories has brought great convenience to people's lives. While the main frequency of the microprocessor is increasing day by day and the performance is increasing rapidly, the single chip capacity of the memory is constantly hitting a new high, and the access time is also decreasing. However, the performance of microprocessors is improving at a rate of 60% per year, while the access time of DRAMs is improving at a rate of about 7% per year. As a result, computer designers face a growing gap in processor and memory performance. At present, this is the biggest obstacle to improving the overall performance of the co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F15/16
CPCG06F15/161
Inventor 何虎侯毓敏
Owner TSINGHUA UNIV